发明授权
- 专利标题： Composite for providing a rigid-flexible circuit board construction and method for fabrication thereof
- 专利标题（中）： 用于提供刚性柔性电路板结构的复合材料及其制造方法
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申请号： US913101申请日： 1992-07-14
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公开(公告)号： US5288542A公开(公告)日： 1994-02-22
- 发明人: Michael J. Cibulsky , Konstantinos I. Papathomas , William J. Summa , David W. Wang , Patrick R. Zippetelli
- 申请人： Michael J. Cibulsky , Konstantinos I. Papathomas , William J. Summa , David W. Wang , Patrick R. Zippetelli
- 申请人地址： NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： NY Armonk
- 主分类号： H05K1/03
- IPC分类号： H05K1/03 ; H05K3/00 ; B32B03/00
摘要：
A composite for providing a rigid-flexible circuit board includes at least one core that contains a dielectric substrate and at least one conductive layer thereon; at least one sub-composite that includes a polyimide and a rigid dielectric substrate; a release layer; at least one rigid bonding layer and a second conductive layer. The composite is used in the fabrication of a rigid-flexible circuit board.
公开/授权文献
- US5937644A Device for extracting energy from moving fluid 公开/授权日：1999-08-17
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