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公开(公告)号：US07027136B2
公开(公告)日：2006-04-11
申请号：US10605994
申请日：2003-11-12
申请人： John C. Tsai , David W. Wang
发明人： John C. Tsai , David W. Wang
IPC分类号： G01N21/00
CPC分类号： G01B11/161
摘要： A structure analysis and defect detection system in which a laser light source provides light via optical fiber to fiber Bragg gratings that change resonant frequency as stresses change in the structure. Light at the resonant frequencies of the fiber Bragg gratings is reflected and light of other frequencies is passed. The respective reflected light is directed through a Fabry-Perot interference filter or a fiber interferometer and detected by a photodetector. If the Fabry-Perot interference filter is used, the intensity of the reflected light indicates current stress at a fiber Bragg grating. If the fiber interferometer is used, a beat frequency due to heterodyne interference in the light indicates current stress at the respective fiber Bragg grating. Comparison data for the respective characteristic in the detected light over time permits stress analysis, and comparison of such data with pre-determined limit values permits defect or failure detection.
摘要翻译： 一种结构分析和缺陷检测系统，其中激光光源通过光纤向光纤布拉格光栅提供光，当结构中的应力变化时，其改变谐振频率。 在光纤布拉格光栅的谐振频率处的光被反射并且其它频率的光通过。 相应的反射光被引导通过法布里 - 珀罗干涉滤光器或光纤干涉仪，并由光电检测器检测。 如果使用法布里 - 珀罗干涉滤波器，则反射光强度表示光纤布拉格光栅处的电流应力。 如果使用光纤干涉仪，则由于光中的外差干扰引起的拍频表示各个光纤布拉格光栅处的电流应力。 随着时间的推移，检测光中的各个特性的比较数据允许应力分析，并且将这些数据与预定极限值进行比较允许缺陷或故障检测。
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公开(公告)号：US5605781A
公开(公告)日：1997-02-25
申请号：US483976
申请日：1995-06-07
IPC分类号： C08G73/06 , C08G73/12 , G03F7/004 , G03F7/029 , G03F7/038 , G03F7/039 , H01L21/027 , G03F7/0269
CPC分类号： C08G73/126 , C08G73/0655 , C08G73/0661 , C08G73/12 , G03F7/029 , G03F7/0385
摘要： A photosensitive composition containing a curable cyanate ester and a cationic photoinitiator; and use thereof to form a resist image.
摘要翻译： 含有可固化氰酸酯和阳离子光引发剂的光敏组合物; 并使用它们来形成抗蚀剂图像。
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公开(公告)号：US5464726A
公开(公告)日：1995-11-07
申请号：US348944
申请日：1994-11-25
IPC分类号： C08G73/06 , C08G73/12 , G03F7/004 , G03F7/029 , G03F7/038 , G03F7/039 , H01L21/027 , G03F7/38
CPC分类号： C08G73/126 , C08G73/0655 , C08G73/0661 , C08G73/12 , G03F7/029 , G03F7/0385
摘要： A photosensitive composition containing a curable cyanate ester and a cationic photoinitiator; and use thereof to form a resist image.
摘要翻译： 含有可固化氰酸酯和阳离子光引发剂的光敏组合物; 并使用它们来形成抗蚀剂图像。
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公开(公告)号：US5319244A
公开(公告)日：1994-06-07
申请号：US806410
申请日：1991-12-13
IPC分类号： H01L23/12 , B32B7/12 , C09D179/04 , H01B3/30 , H01L23/14 , H05K1/03 , H05K3/38 , H05K3/46 , B32B3/00
CPC分类号： H01B3/303 , B32B7/12 , C09D179/04 , H05K1/036 , H05K2201/0154 , H05K2201/0195 , H05K3/4626 , Y10S428/901 , Y10T428/24917
摘要： Disclosed are thin film triazine adhesives on organic carriers, method for making them and microelectronic circuit packages incorporating them. The circuit package has a substrate made up of organic, dielectric, polymeric sheets. At least one pair of the polymeric sheets face each other and are adhesively joined together by a triazine polymer.
摘要翻译： 公开了有机载体上的薄膜三嗪粘合剂，其制备方法和结合它们的微电子电路封装。 电路封装具有由有机，电介质，聚合物片构成的衬底。 至少一对聚合物片彼此面对并通过三嗪聚合物粘合在一起。
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5.发明授权Composite for providing a rigid-flexible circuit board construction and method for fabrication thereof 失效用于提供刚性柔性电路板结构的复合材料及其制造方法
公开(公告)号：US5288542A
公开(公告)日：1994-02-22
申请号：US913101
申请日：1992-07-14
申请人： Michael J. Cibulsky , Konstantinos I. Papathomas , William J. Summa , David W. Wang , Patrick R. Zippetelli
发明人： Michael J. Cibulsky , Konstantinos I. Papathomas , William J. Summa , David W. Wang , Patrick R. Zippetelli
CPC分类号： H05K3/4691 , H05K1/0366 , H05K2201/0355 , H05K2203/308 , Y10S428/901 , Y10T428/24851 , Y10T428/2486 , Y10T428/24917 , Y10T428/31522 , Y10T428/31678 , Y10T428/31721
摘要： A composite for providing a rigid-flexible circuit board includes at least one core that contains a dielectric substrate and at least one conductive layer thereon; at least one sub-composite that includes a polyimide and a rigid dielectric substrate; a release layer; at least one rigid bonding layer and a second conductive layer. The composite is used in the fabrication of a rigid-flexible circuit board.
摘要翻译： 用于提供刚性柔性电路板的复合材料包括至少一个包含电介质基底和至少一个导电层的芯; 至少一个亚复合材料，其包括聚酰亚胺和刚性电介质基片; 释放层; 至少一个刚性粘合层和第二导电层。 复合材料用于刚性柔性电路板的制造。
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公开(公告)号：US5194930A
公开(公告)日：1993-03-16
申请号：US760654
申请日：1991-09-16
IPC分类号： C09J163/00 , H01L21/56 , H01L23/29 , H01L23/31
CPC分类号： H01L21/563 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/01014 , H01L2924/01019 , H01L2924/01087 , H01L2924/10253
摘要： Composition and solder interconnection structure for its use, wherein the gap created by solder connections between a carrier substrate and a semiconductor chip device mounted thereon is filled with the solvent free formulation obtained by curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof, polyol, and filler which is substantially free of alpha particle emissions.
摘要翻译： 用于其使用的组合物和焊料互连结构，其中通过在载体衬底和安装在其上的半导体芯片器件之间的焊料连接产生的间隙填充有通过固化含有脂环族聚环氧化物和/或可固化氰酸酯的制剂而获得的无溶剂配方，或 其预聚物，多元醇和基本上不含α粒子排放物的填料。
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公开(公告)号：US4999699A
公开(公告)日：1991-03-12
申请号：US493126
申请日：1990-03-14
CPC分类号： H01L24/81 , H01L21/563 , H01L23/293 , H01L2224/73203 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/01087 , H01L2924/01092 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H05K3/284 , H05K3/285 , H05K3/3431 , Y10T428/31504 , Y10T428/31547
摘要： Solder interconnection whereby the gap created by solder connections between a carrier substrate and semiconductor device is filled with a composition obtained from curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof; filler having a maximum particle size of 31 microns and being at least substantially free of alpha particle emissions.
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公开(公告)号：US4745215A
公开(公告)日：1988-05-17
申请号：US33557
申请日：1987-04-03
申请人： Robert J. Cox , William J. Summa , David W. Wang
发明人： Robert J. Cox , William J. Summa , David W. Wang
CPC分类号： C07C261/02 , H05K1/034 , Y10T428/31547
摘要： 4,4'-(Hexafluoroisopropylidene) bisphonol dicyanate and related compounds have reduced dielectric constant, reduced moisture absorption, and increase Tg making such compounds especially suitable for various electronic applications, such as circuit packaging or in forming prepregs and circuit boards.
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公开(公告)号：US4705820A
公开(公告)日：1987-11-10
申请号：US903791
申请日：1986-09-05
CPC分类号： C08G63/64 , A61L17/145 , C08G63/08
摘要： A surgical suture coating comprising a random copolymer is disclosed. The copolymer has about 25 to 75 weight percent of glycolic acid ester linkages. The remaining linkages comprise at least trimethylene carbonate. The copolymer has a glass transition temperature at or below ambient temperature.
摘要翻译： 公开了包含无规共聚物的手术缝合涂层。 共聚物具有约25至75重量％的乙醇酸酯键。 剩余的键至少包含三亚甲基碳酸酯。 该共聚物的玻璃化转变温度为环境温度或低于环境温度。
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公开(公告)号：US4636535A
公开(公告)日：1987-01-13
申请号：US691993
申请日：1985-01-16
申请人： David W. Wang , Jeanne L. Courter , Dalip K. Kohli
发明人： David W. Wang , Jeanne L. Courter , Dalip K. Kohli
IPC分类号： C08G59/00 , C07D207/40 , C07D207/404 , C07D303/36 , C08G59/22 , C08G59/32 , C08G59/38 , C08G59/50 , C08G59/52 , C08G59/56 , C08K7/02 , C08K7/06 , C08L63/00 , C08L79/08 , C08K3/34 , C08K3/02 , C08K3/04 , C08L61/00
CPC分类号： C07D207/404 , C07D303/36 , C08G59/22 , C08G59/32 , C08G59/38 , C08G59/50 , C08G59/52 , C08K7/06 , C08L63/00 , C08L79/08
摘要： Curable compositions are provided comprising epoxide prepolymers and polyaminobenzoates, alone, or combined with reinforcements, e.g., graphite fibers, and, optionally modified with second resins. The cured fiber resin matrix compositions exhibit high toughness combined with excellent hot/wet strength.
摘要翻译： 提供可固化的组合物，其包含单独的环氧化物预聚物和聚氨基苯甲酸酯，或与增强剂如石墨纤维组合，并且任选地用第二树脂改性。 固化的纤维树脂基质组合物显示出高韧性以及优异的热/湿强度。
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