发明授权
US5293072A Semiconductor device having spherical terminals attached to the lead
frame embedded within the package body
失效
半导体器件具有附接到嵌入在封装主体内的引线框架的球形端子
- 专利标题： Semiconductor device having spherical terminals attached to the lead frame embedded within the package body
- 专利标题（中）： 半导体器件具有附接到嵌入在封装主体内的引线框架的球形端子
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申请号： US53802申请日： 1993-04-29
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公开(公告)号： US5293072A公开(公告)日： 1994-03-08
- 发明人: Kazuto Tsuji , Tetsuya Hiraoka , Tsuyoshi Aoki , Junichi Kasai
- 申请人： Kazuto Tsuji , Tetsuya Hiraoka , Tsuyoshi Aoki , Junichi Kasai
- 申请人地址： JPX Kawasaki
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JPX Kawasaki
- 优先权： JPX2-165979 19900625
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; H01L21/56 ; H01L23/495 ; H05K3/34 ; H01L23/48 ; H01L29/44 ; H01L29/52 ; H01L29/60
摘要：
A semiconductor device accommodated in a package includes a semiconductor chip, a package body for accommodating the semiconductor chip, and a plurality of terminal members embedded in the package body in electrical connection to the semiconductor chip and projecting from a bottom surface of the package body, wherein each of said terminal members is of spherical form, and of a substantially identical diameter.
公开/授权文献
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