公开(公告)号：US5293072A

公开(公告)日：1994-03-08

申请号：US53802

申请日：1993-04-29

申请人： Kazuto Tsuji ,  Tetsuya Hiraoka ,  Tsuyoshi Aoki ,  Junichi Kasai

发明人： Kazuto Tsuji ,  Tetsuya Hiraoka ,  Tsuyoshi Aoki ,  Junichi Kasai

IPC分类号： H01L21/48 ,  H01L21/56 ,  H01L23/495 ,  H05K3/34 ,  H01L23/48 ,  H01L29/44 ,  H01L29/52 ,  H01L29/60

CPC分类号： H01L21/4825 ,  H01L21/565 ,  H01L23/49517 ,  H05K3/3478 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/082 ,  Y10T29/49149

摘要： A semiconductor device accommodated in a package includes a semiconductor chip, a package body for accommodating the semiconductor chip, and a plurality of terminal members embedded in the package body in electrical connection to the semiconductor chip and projecting from a bottom surface of the package body, wherein each of said terminal members is of spherical form, and of a substantially identical diameter.

摘要翻译： 容纳在封装中的半导体器件包括半导体芯片，用于容纳半导体芯片的封装体和与半导体芯片电连接并且从封装主体的底表面突出的嵌入封装体的多个端子构件， 其中每个所述端子构件是球形的，并且具有基本相同的直径。

公开(公告)号：US5403776A

公开(公告)日：1995-04-04

申请号：US152239

申请日：1993-11-16

申请人： Kazuto Tsuji ,  Tetsuya Hiraoka ,  Tsuyoshi Aoki ,  Junichi Kasai

发明人： Kazuto Tsuji ,  Tetsuya Hiraoka ,  Tsuyoshi Aoki ,  Junichi Kasai

IPC分类号： H01L21/48 ,  H01L21/56 ,  H01L23/495 ,  H05K3/34 ,  H01L21/28 ,  H01L21/58 ,  H01L21/60

CPC分类号： H01L21/4825 ,  H01L21/565 ,  H01L23/49517 ,  H05K3/3478 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/082 ,  Y10T29/49149

摘要： A process of manufacturing semiconductor device accommodated in a package including a semiconductor chip, a package body for accommodating the semiconductor chip, and a plurality of terminal members embedded in the package body in electrical connection to the semiconductor chip and projecting from a bottom surface of the package body, wherein each of said terminal members is of spherical form, such that the terminal members roll substantially freely when placed on a flat surface, and of a substantially identical diameter.

摘要翻译： 一种制造半导体器件的方法，该半导体器件容纳在包括半导体芯片，用于容纳半导体芯片的封装主体和与半导体芯片电连接的嵌入封装主体中的多个端子构件的封装中，并且从底部表面突出 封装体，其中每个所述端子构件是球形的，使得当放置在平坦表面上并且具有基本相同的直径时，端子构件基本上自由地滚动。

公开(公告)号：US06573121B2

公开(公告)日：2003-06-03

申请号：US09809105

申请日：2001-03-16

申请人： Yoshiyuki Yoneda ,  Ryuji Nomoto ,  Toshiyuki Motooka ,  Kazuto Tsuji ,  Junichi Kasai ,  Toshimi Kawahara ,  Hideharu Sakoda ,  Kenji Itasaka ,  Terumi Kamifukumoto

发明人： Yoshiyuki Yoneda ,  Ryuji Nomoto ,  Toshiyuki Motooka ,  Kazuto Tsuji ,  Junichi Kasai ,  Toshimi Kawahara ,  Hideharu Sakoda ,  Kenji Itasaka ,  Terumi Kamifukumoto

IPC分类号： H01L2144

CPC分类号： H01L21/4832 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6833 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L24/97 ,  H01L25/105 ,  H01L29/0657 ,  H01L2224/05554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/45644 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/83001 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85365 ,  H01L2224/85986 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/19043 ,  H01L2924/3011 ,  H05K1/181 ,  H05K3/303 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/09045 ,  H05K2201/10727 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2224/85 ,  H01L2924/01004 ,  H01L2924/00011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A semiconductor device includes a semiconductor element, a resin package sealing the semiconductor element, resin projections protruding downward from a mounting surface of the resin package, metallic film portions provided to the resin projections, and connecting members electrically connecting the semiconductor elements to the metallic film parts. Outer circumference surfaces of the resin package are upright surfaces defined by cutting.

公开(公告)号：US06376921B1

公开(公告)日：2002-04-23

申请号：US09192201

申请日：1998-11-16

申请人： Yoshiyuki Yoneda ,  Ryuji Nomoto ,  Toshiyuki Motooka ,  Kazuto Tsuji ,  Junichi Kasai ,  Toshimi Kawahara ,  Hideharu Sakoda ,  Kenji Itasaka ,  Terumi Kamifukumoto

发明人： Yoshiyuki Yoneda ,  Ryuji Nomoto ,  Toshiyuki Motooka ,  Kazuto Tsuji ,  Junichi Kasai ,  Toshimi Kawahara ,  Hideharu Sakoda ,  Kenji Itasaka ,  Terumi Kamifukumoto

IPC分类号： H01L2328

CPC分类号： H01L21/4832 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6833 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L24/97 ,  H01L25/105 ,  H01L29/0657 ,  H01L2224/05554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/45644 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/83001 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85365 ,  H01L2224/85986 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/19043 ,  H01L2924/3011 ,  H05K1/181 ,  H05K3/303 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/09045 ,  H05K2201/10727 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2224/85 ,  H01L2924/01004 ,  H01L2924/00011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A semiconductor device includes a semiconductor element, a resin package sealing the semiconductor element, resin projections protruding downward from a mounting surface of the resin package, metallic film portions provided to the resin projections, and connecting members electrically connecting the semiconductor elements to the metallic film parts.

摘要翻译： 半导体器件包括半导体元件，密封半导体元件的树脂封装，从树脂封装的安装表面向下突出的树脂突起，设置在树脂突起上的金属膜部分和将半导体元件电连接到金属膜的连接构件 部分。

公开(公告)号：US6025650A

公开(公告)日：2000-02-15

申请号：US961243

申请日：1997-10-30

申请人： Kazuto Tsuji ,  Yoshiyuki Yoneda ,  Hideharu Sakoda ,  Ryuuji Nomoto ,  Eiji Watanabe ,  Seiichi Orimo ,  Masanori Onodera ,  Junichi Kasai

发明人： Kazuto Tsuji ,  Yoshiyuki Yoneda ,  Hideharu Sakoda ,  Ryuuji Nomoto ,  Eiji Watanabe ,  Seiichi Orimo ,  Masanori Onodera ,  Junichi Kasai

IPC分类号： H01L23/12 ,  H01L21/56 ,  H01L21/68 ,  H01L23/31 ,  H01L23/495 ,  H01L23/48 ,  H01L29/41

CPC分类号： H01L21/6835 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49548 ,  H01L24/49 ,  H01L2221/68377 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/4943 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18165

摘要： This invention relates to a semiconductor device in which a plurality of outer terminals are arranged in a lattice formation on a flat surface. The semiconductor device comprises a semiconductor chip having a plurality of pads, a resin portion sealing said semiconductor chip and a terminal portion in which a prescribed number of pole terminals electrically connected to said pads provided in said semiconductor chip are provided, said pole terminals being exposed from said resin portion. According to the invention, a cost for production is reduced and a reliability and electrical characteristics can be improved.

摘要翻译： 本发明涉及一种半导体器件，其中多个外部端子以平坦表面的格子状排列。 半导体器件包括具有多个焊盘的半导体芯片，密封所述半导体芯片的树脂部分和设置有电连接到设置在所述半导体芯片中的所述焊盘的规定数量的极端子的端子部分，所述极端子露出 从所述树脂部分。 根据本发明，生产成本降低，并且可以提高可靠性和电气特性。

公开(公告)号：US5842628A

公开(公告)日：1998-12-01

申请号：US628936

申请日：1996-04-08

申请人： Ryuji Nomoto ,  Kazuto Tsuji ,  Mitsutaka Sato ,  Junichi Kasai

发明人： Ryuji Nomoto ,  Kazuto Tsuji ,  Mitsutaka Sato ,  Junichi Kasai

IPC分类号： B23K20/00 ,  H01L21/607 ,  B23K31/02

CPC分类号： H01L24/85 ,  B23K20/004 ,  H01L24/03 ,  H01L24/05 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  B23K2201/40 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48475 ,  H01L2224/48479 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/49109 ,  H01L2224/4945 ,  H01L2224/78301 ,  H01L2224/78302 ,  H01L2224/85009 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2224/85191 ,  H01L2224/85205 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L24/45 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/181

摘要： A wire bonding method includes a first bonding process for forming a first ball-shaped part in a wire and bonding the first ball-shaped part to a first connected member; a ball-shaped part forming process for guiding the wire away from a position where the wire is bonded to an inner lead so as to form a predetermined loop, and forming a second ball-shaped part in a predetermined position in the wire; and a second bonding process for bonding the second ball-shaped part to a semiconductor element pad that serves as a second connected member.

摘要翻译： 引线接合方法包括用于在线中形成第一球形部分并将第一球形部分接合到第一连接部件的第一接合工艺; 一种用于将线材从导线接合的位置引导到内部引线以形成预定环路的滚珠形部分形成工艺，并且在线材中的预定位置形成第二球形部分; 以及用于将第二球形部件接合到用作第二连接部件的半导体元件衬垫的第二接合工艺。

公开(公告)号：US5831332A

公开(公告)日：1998-11-03

申请号：US739218

申请日：1996-10-29

申请人： Michio Sono ,  Junichi Kasai ,  Masanori Yoshimoto ,  Kazuto Tsuji ,  Kouji Saito

发明人： Michio Sono ,  Junichi Kasai ,  Masanori Yoshimoto ,  Kazuto Tsuji ,  Kouji Saito

IPC分类号： H01L23/482 ,  H01L23/495 ,  H01L23/58 ,  H05K3/30 ,  H05K3/34

CPC分类号： H05K3/303 ,  H01L23/49555 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01079 ,  H05K2201/09709 ,  H05K2201/09781 ,  H05K2201/10454 ,  H05K2201/10522 ,  H05K2201/10568 ,  H05K2201/10659 ,  H05K2201/10696 ,  H05K3/3426 ,  Y02P70/613

摘要： A semiconductor device having a package of a single in-line type includes a semiconductor chip, a package body that accommodates the semiconductor chip therein and defined by a pair of opposing major surfaces and a plurality of interconnection leads held by the package body to extend substantially perpendicularly to a bottom surface. Each of the interconnection leads consists of an inner lead part located inside the package body and an outer lead part located outside the package body, the outer lead part being bent laterally at a boundary between the inner part and the outer part, in one of first and second directions that are opposite from each other and substantially perpendicular to the opposing major surfaces of the package body. A plurality of support legs extend laterally at the bottom surface of the package body for supporting the package body upright when the semiconductor device is placed on a substrate.

公开(公告)号：US5440170A

公开(公告)日：1995-08-08

申请号：US849378

申请日：1992-06-29

申请人： Kazuto Tsuji ,  Yoshiyuki Yoneda ,  Junichi Kasai

发明人： Kazuto Tsuji ,  Yoshiyuki Yoneda ,  Junichi Kasai

IPC分类号： H01L23/495 ,  H01L23/48 ,  H01L29/41

CPC分类号： H01L23/49548 ,  H01L23/49503 ,  H01L23/49551 ,  H01L23/49558 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/12042 ,  H01L2924/181

摘要： A semiconductor device employs a lead frame including a die pad (24) and a plurality of leads (25) provided outside the die pad, and is manufactured by sealing the die pad and its periphery by a resin after the die pad is fitted with the semiconductor chip (11). The die pad (24) is formed separately from the main part of the lead frame provided with leads, and is rounded at an entire outermost edge thereof and includes a flat plate shape. This die pad can be either formed rounded with ceramic or resin, or formed in metal and given a rounded edge through honing.

摘要翻译： PCT No.PCT / JP91 / 01195 Sec。 371日期：1992年6月29日 102（e）日期1992年6月29日PCT 1991年9月9日PCT公布。 出版物WO92 / 04730 日期：1992年3月19日。半导体器件采用引线框架，该引线框架包括设置在管芯焊盘外部的管芯焊盘（24）和多个引线（25），并通过树脂封装管芯焊盘及其周边 芯片焊盘装配有半导体芯片（11）。 管芯焊盘（24）与设置有引线的引线框架的主要部分分开形成，并且在其整个最外边缘处成圆形，并且包括平板形状。 该模垫可以用陶瓷或树脂形成圆形，或者以金属形成，并通过珩磨赋予圆形边缘。

公开(公告)号：US06856017B2

公开(公告)日：2005-02-15

申请号：US09442038

申请日：1999-11-17

申请人： Yoshiyuki Yoneda ,  Kazuto Tsuji ,  Seiichi Orimo ,  Hideharu Sakoda ,  Ryuji Nomoto ,  Masanori Onodera ,  Junichi Kasai

发明人： Yoshiyuki Yoneda ,  Kazuto Tsuji ,  Seiichi Orimo ,  Hideharu Sakoda ,  Ryuji Nomoto ,  Masanori Onodera ,  Junichi Kasai

IPC分类号： H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/68 ,  H01L21/683 ,  H01L23/31 ,  H01L25/10 ,  H01L29/06 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H01L23/04

CPC分类号： H01L21/4832 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/67138 ,  H01L21/6833 ,  H01L23/3107 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L24/97 ,  H01L25/105 ,  H01L29/0657 ,  H01L2224/05554 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85664 ,  H01L2224/85986 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/3011 ,  H05K1/181 ,  H05K3/303 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/09045 ,  H05K2201/10727 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A device including a chip, and a resin package sealing the chip, the resin package having resin projections located on a mount-side surface of the resin package. Metallic films are respectively provided to the resin projections. Connecting parts electrically connect electrode pads of the chip and the metallic film.

摘要翻译： 一种包括芯片的装置和密封芯片的树脂封装，树脂封装具有位于树脂封装的安装侧表面上的树脂突起。 金属膜分别设置在树脂突起上。 连接部件电连接芯片的电极焊盘和金属膜。

公开(公告)号：US06696754B2

公开(公告)日：2004-02-24

申请号：US10214306

申请日：2002-08-08

申请人： Mitsutaka Sato ,  Tetsuya Fujisawa ,  Shigeyuki Maruyama ,  Junichi Kasai ,  Toshimi Kawahara ,  Toshio Hamano ,  Yoshihiro Kubota ,  Mitsunada Osawa ,  Yoshiyuki Yoneda ,  Kazuto Tsuji ,  Hirohisa Matsuki

发明人： Mitsutaka Sato ,  Tetsuya Fujisawa ,  Shigeyuki Maruyama ,  Junichi Kasai ,  Toshimi Kawahara ,  Toshio Hamano ,  Yoshihiro Kubota ,  Mitsunada Osawa ,  Yoshiyuki Yoneda ,  Kazuto Tsuji ,  Hirohisa Matsuki

IPC分类号： H01L2334

CPC分类号： H01L25/105 ,  H01L2224/48227 ,  H01L2225/1023 ,  H01L2924/09701 ,  H01L2924/1533 ,  H01L2924/3025 ,  H01R12/82 ,  H05K7/1431 ,  H01L2924/00

摘要： A semiconductor module includes a plurality of semiconductor devices each including a circuit substrate carrying thereon a single memory semiconductor chip and a socket for holding the semiconductor devices detachably.

摘要翻译： 半导体模块包括多个半导体器件，每个半导体器件包括承载有单个存储器半导体芯片的电路衬底和用于可拆卸地保持半导体器件的插座。