发明授权
- 专利标题： Adhesive tapes for tape automated bonding
- 专利标题（中）： 用于胶带自动粘接的胶带
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申请号： US980230申请日： 1992-11-23
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公开(公告)号： US5298304A公开(公告)日： 1994-03-29
- 发明人: Hitoshi Narushima , Yoshikazu Tsukamoto , Tadahiro Oishi , Atsushi Koshimura
- 申请人： Hitoshi Narushima , Yoshikazu Tsukamoto , Tadahiro Oishi , Atsushi Koshimura
- 申请人地址： JPX Tokyo
- 专利权人： Tomoegawa Paper Co., Ltd.
- 当前专利权人： Tomoegawa Paper Co., Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX2-117444 19900123; JPX2-19265 19900130
- 主分类号： H01L23/14
- IPC分类号： H01L23/14 ; C09J7/02
摘要：
This invention relates to an adhesive tape for tape automated bonding (TAB). A first type of the adhesive tape for TAB according to the invention has a protective film and an adhesive layer laminated on an organic-insulating film. This adhesive layer is characterized by comprising at least resol-type phenol resin and polyamide resin, wherein from 2 to 35% of said resol-type resin is contained in the adhesive layer. A second type of the adhesive tape for TAB according to the invention has a protective film and an adhesive layer laminated on an organic-insulating film. This adhesive layer is characterized by having at least two layers: one comprising at least polyamide resin and being laminated on one surface of said organic-insulating film and; other comprising at least polyamide resin and resol-type resin and being laminated on other surface of said protective film.