A package for a frequency selection component includes a base, a thermoplastic die attachment, and either a soldered or low- melting-temperature glass lid attachment. These techniques can be employed in either a leadless chip carrier or a single layer ceramic base configuration. A package for a surface acoustic wave device in accordance with one embodiment of the invention is suitable for enclosing the device in a hermetically sealed environment such that the resulting structure takes up a minimum volume of space. The package facilitates automated circuit assembly techniques, allowing compact, low cost products to incorporate frequency selection components when these are made in accordance with the present invention.