发明授权
- 专利标题： Dicing-die bonding film
- 专利标题（中）： 切割芯片接合膜
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申请号： US998847申请日： 1992-12-30
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公开(公告)号： US5304418A公开(公告)日： 1994-04-19
- 发明人: Yuzo Akada , Koji Akazawa , Keiji Nakamoto
- 申请人： Yuzo Akada , Koji Akazawa , Keiji Nakamoto
- 申请人地址： JPX Osaka
- 专利权人： Nitto Denko Corporation
- 当前专利权人： Nitto Denko Corporation
- 当前专利权人地址： JPX Osaka
- 优先权： JPX3-358886 19911230
- 主分类号： C09J7/02
- IPC分类号： C09J7/02 ; C09J4/00 ; C09J163/00 ; H01L21/301 ; H01L21/302 ; H01L21/58 ; H01L21/68 ; B32B7/12
摘要：
A dicing-die bonding film comprising an ultraviolet-transmitting substrate having provided thereon an ultraviolet-curable pressure-sensitive adhesive layer and an adhesive layer in this order, the pressure-sensitive adhesive layer having been partly ultraviolet-cured to have cured parts and uncured parts. The film has a well-balanced combination of a holding power for supporting a semiconductor wafer during dicing and release properties for enabling cut chips to be easily released together with the adhesive layer so that even large-sized chips as larger than 10 mm.times.10 mm can easily be picked up.
公开/授权文献
- US5958343A Small volume pipettor 公开/授权日：1999-09-28
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