发明授权
- 专利标题： Electroless bismuth plating bath
- 专利标题（中）： 无电镀铋电镀浴
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申请号： US13701申请日： 1993-02-04
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公开(公告)号： US5306335A公开(公告)日： 1994-04-26
- 发明人: Atsuo Senda , Takuji Nakagawa , Yoshihiko Takano
- 申请人： Atsuo Senda , Takuji Nakagawa , Yoshihiko Takano
- 申请人地址： JPX
- 专利权人： Murata Manufacturing Co., Ltd.
- 当前专利权人： Murata Manufacturing Co., Ltd.
- 当前专利权人地址： JPX
- 优先权： JPX4-019751 19920205
- 主分类号： C23C18/31
- IPC分类号： C23C18/31 ; C23C18/52 ; C23C18/16
摘要：
In an electroless plating bath containing bismuth trichloride, a reducing agent and complexing agents, stannous chloride is employed as the reducing agent to enable electroless plating of bismuth, which has generally been regarded as impossible. A preferable composition of the plating bath is 0.08M of bismuth trichloride, 0.34M of sodium citrate, 0.08M of EDTA, 0.20M of nitrilotriacetic acid, and 0.04M of stannous chloride. In plating treatment, the plating bath preferably has a temperature of 60.degree. C. and a pH value of 8.6 to 8.8.
公开/授权文献
- USD354382S Cart 公开/授权日：1995-01-10
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