-
公开(公告)号：US5306335A
公开(公告)日：1994-04-26
申请号：US13701
申请日：1993-02-04
申请人： Atsuo Senda , Takuji Nakagawa , Yoshihiko Takano
发明人： Atsuo Senda , Takuji Nakagawa , Yoshihiko Takano
CPC分类号： C23C18/52
摘要： In an electroless plating bath containing bismuth trichloride, a reducing agent and complexing agents, stannous chloride is employed as the reducing agent to enable electroless plating of bismuth, which has generally been regarded as impossible. A preferable composition of the plating bath is 0.08M of bismuth trichloride, 0.34M of sodium citrate, 0.08M of EDTA, 0.20M of nitrilotriacetic acid, and 0.04M of stannous chloride. In plating treatment, the plating bath preferably has a temperature of 60.degree. C. and a pH value of 8.6 to 8.8.
摘要翻译： 在含有三氯化铋，还原剂和络合剂的化学镀浴中，使用氯化亚锡作为还原剂，以使得通常被认为是不可能的铋化学镀。 镀浴的优选组成为0.08M三氯化铋，0.34M柠檬酸钠，0.08M EDTA，0.20M次氮基三乙酸和0.04M氯化亚锡。 在电镀处理中，电镀浴的温度优选为60℃，pH值为8.6〜8.8。
-
公开(公告)号：US5160373A
公开(公告)日：1992-11-03
申请号：US713782
申请日：1991-06-12
申请人： Atsuo Senda , Takuji Nakagawa , Yoshihiko Takano
发明人： Atsuo Senda , Takuji Nakagawa , Yoshihiko Takano
CPC分类号： C23C18/52
摘要： An electroless plating bath for depositing a metal selected from the group consisting of Ni, Zn, As, Cd, In, Sb, Pb and alloys thereof, which contains a titanium (III) compound as a reducing agent. Typical titanium (III) compounds are titanium halides, cyclopentadienyl complex compounds of titanium (III) ions, titanium sulfate, and titanium hydroxide.
摘要翻译： 一种用于沉积选自Ni，Zn，As，Cd，In，Sb，Pb的金属和含有钛（III）化合物作为还原剂的合金的化学镀浴。 典型的钛（III）化合物是钛卤化物，钛（III）离子的环戊二烯基络合物化合物，硫酸钛和氢氧化钛。
-
公开(公告)号：US5435830A
公开(公告)日：1995-07-25
申请号：US257268
申请日：1994-06-09
申请人： Atsuo Senda , Takuji Nakagawa , Yoshihiko Takano
发明人： Atsuo Senda , Takuji Nakagawa , Yoshihiko Takano
IPC分类号： B22F9/24
CPC分类号： B22F9/24
摘要： First, an aqueous solution of water soluble compounds or an aqueous solution of water soluble complexes, which is a salt of elements belonging to the 6A, 7A, 1B, 2B, 3B, 4B, 5B, 6B, or 8 group in a periodic table are prepared. The pH of the aqueous solution is adjusted and titanium trichloride is added thereto. The aqueous solution provided with titanium trichloride is stirred at temperature below the boiling point of the solution under atmospheric pressure or under high pressure. Then, by the reducing action of the titanium trichloride, a fine titanium-free powder selected from the group consisting of a metal powder, an alloy powder containing two or more of metals and non-metals, or a compound powder containing two or more of metals and non-metals is obtained.
摘要翻译： 首先，作为元素周期表中属于6A，7A，1B，2B，3B，4B，5B，6B或8族的元素的盐的水溶性化合物的水溶液或水溶性络合物的水溶液 准备好了 调节水溶液的pH，并向其中加入三氯化钛。 提供三氯化钛的水溶液在大气压或高压下在低于溶液沸点的温度下搅拌。 然后，通过三氯化钛的还原作用，可以使用选自金属粉末，含有两种以上金属和非金属的合金粉末的微细的无钛粉末，或者含有两种以上的金属和非金属的化合物粉末 获得金属和非金属。
-
公开(公告)号：US5368896A
公开(公告)日：1994-11-29
申请号：US191036
申请日：1994-02-03
申请人： Atsuo Senda , Takuji Nakagawa , Yoshihiko Takano
发明人： Atsuo Senda , Takuji Nakagawa , Yoshihiko Takano
CPC分类号： C23C18/52
摘要： In an electroless plating bath containing bismuth trichloride, a reducing agent and complexing agents, stannous chloride is employed as the reducing agent to enable electroless plating of bismuth, which has generally been regarded as impossible. A preferable composition of the plating bath is 0.08M of bismuth trichloride, 0.34M of sodium citrate, 0.08M of EDTA, 0.20M of nitrilotriacetic acid, and 0.04M of stannous chloride. In plating treatment, the plating bath preferably has a temperature of 60.degree. C. and a pH value of 8.6 to 8.8.
摘要翻译： 在含有三氯化铋，还原剂和络合剂的化学镀浴中，使用氯化亚锡作为还原剂，以使得通常被认为是不可能的铋化学镀。 镀浴的优选组成为0.08M三氯化铋，0.34M柠檬酸钠，0.08M EDTA，0.20M次氮基三乙酸和0.04M氯化亚锡。 在电镀处理中，电镀浴的温度优选为60℃，pH值为8.6〜8.8。
-
公开(公告)号：US5360471A
公开(公告)日：1994-11-01
申请号：US101387
申请日：1993-08-02
申请人： Yoshihiko Takano , Atsuo Senda
发明人： Yoshihiko Takano , Atsuo Senda
CPC分类号： C23C18/48 , B23K35/262 , H05K3/3473
摘要： Disclosed herein is an electroless solder plating bath capable of autocatalytically depositing solder on a metal such as copper or nickel or an activated non-conductor base material in an arbitrary film thickness and an arbitrary film composition. This plating bath contains bivalent ions of tin and bivalent ions of lead as metal ions, a complexing agent, and a reductant, while the reductant contains trivalent titanium ions. The plating bath can be used at a temperature of 40.degree. to 80.degree. C., with a pH value of 5.0 to 11.0.
摘要翻译： 本发明公开了一种能够在任意的膜厚度和任意的膜组成中在诸如铜或镍的金属或活性非导体基材上自动催化沉积焊料的无电焊料电镀浴。 该镀液含有作为金属离子的铅的二价离子和铅的二价离子，络合剂和还原剂，而还原剂含有三价钛离子。 电镀浴可以在40〜80℃的温度下使用，pH值为5.0〜11.0。
-
公开(公告)号：US5576053A
公开(公告)日：1996-11-19
申请号：US395620
申请日：1995-02-28
申请人： Atsuo Senda , Yoshihiko Takano , Kazuhiro Morita
发明人： Atsuo Senda , Yoshihiko Takano , Kazuhiro Morita
CPC分类号： H01G4/005 , C23C18/1608 , C23C18/1651 , C23C18/1831 , C23C18/34 , C23C18/36 , C23C18/48 , C23C18/52 , H05K3/246 , H05K1/092
摘要： Electrodes are formed on an electronic part by an initial step of forming electrodes on a ceramic substrate, dipping the ceramic substrate in a noble metal solution for activating the surface of the electrodes by the use of a noble metal, and forming a solder layer or a tin layer on the activated surface of the electrode by electroless plating using 3-valence titanium ion as a reducing agent. The electrodes to be formed on the ceramic substrate may be a double layer comprised of a first layer containing silver, silver-palladium, silver-platinum or copper and a second electroless nickel plated layer. In the step of forming a solder layer or a tin layer on the activated surface of the electrode by electroless plating using 3-valence titanium ion a reducing agent, it is preferable to add a metal ion except tin and lead in the plating bath. Preferably, the metal ion added in the plating bath may be alkali earth metal element or may be at least one ion selected from the group consisting of Mg.sup.2+, Ca.sup.2+, Sr.sup.2+, Ba.sup.2+, Al.sup.3+, Mn.sup.2+, Fe.sup.3+, Co.sup.2+, Ni.sup.2+, and Zn.sup.2+.
摘要翻译： 电极通过在陶瓷基板上形成电极的初始步骤形成在电子部件上，通过使用贵金属将陶瓷基板浸入用于活化电极表面的贵金属溶液中，并形成焊料层或 通过使用3价钛离子作为还原剂的化学镀，在电极的活化表面上形成锡层。 要形成在陶瓷衬底上的电极可以是由包含银，银 - 钯，银 - 铂或铜的第一层和第二无电镀镍层组成的双层。 在通过使用3价钛离子还原剂的化学镀来在电极的活化面上形成焊料层或锡层的工序中，优选在镀浴中添加锡和铅以外的金属离子。 优选地，添加在镀浴中的金属离子可以是碱土金属元素，或者可以是选自Mg 2+，Ca 2+，Sr 2+，Ba 2+，Al 3+，Mn 2+，Fe 3+，Co 2+，Ni 2+和Zn 2+中的至少一种离子。
-
公开(公告)号：US5364459A
公开(公告)日：1994-11-15
申请号：US208962
申请日：1994-03-09
申请人： Atsuo Senda , Kazuhiro Morita , Yoshihiko Takano
发明人： Atsuo Senda , Kazuhiro Morita , Yoshihiko Takano
CPC分类号： C23C18/52
摘要： In order to provide an electroless plating solution containing trivalent titanium ions for serving as a reductant which can deposit a plating film in a pH range between a weak acid level and a weak alkaline level with excellent stability, carbonate such as sodium carbonate or potassium carbonate is contained in the electroless plating solution.
摘要翻译： 为了提供含有三价钛离子的化学镀溶液，用作还原剂，其可以在稳定性优良的弱酸性和弱碱性水平之间的pH范围内沉积镀膜，碳酸钠或碳酸钾等碳酸盐是 包含在化学镀溶液中。
-
公开(公告)号：US4871585A
公开(公告)日：1989-10-03
申请号：US177964
申请日：1988-04-05
申请人： Osamu Kano , Yoshihiko Takano , Atsuo Senda
发明人： Osamu Kano , Yoshihiko Takano , Atsuo Senda
CPC分类号： C04B41/009 , C04B41/4572 , C04B41/81 , H05K3/0094 , H05K3/241 , C04B2111/00844 , H05K2201/0133 , H05K2203/0557 , H05K3/181
摘要： A method of plating treatment for forming a plated coating on the surface of a workpiece except on a region thereof comprises the steps of placing a masking member made of water swelling rubber in abutment against or in close proximity to the region of the workpiece where no plating is desired, immersing, in this state, the masking member in water to cause the water swelling rubber to undergo volumetric self-swelling, and immersing the workpiece in a plating solution with the swelled masking member pressed against the particular region of the workpiece.
摘要翻译： 一种用于在除了其区域之外的工件表面上形成电镀涂层的电镀处理方法包括以下步骤：将由水膨胀橡胶制成的掩蔽构件邻接或靠近工件的没有电镀的区域 期望在该状态下将掩蔽构件浸入水中以引起水膨胀橡胶体积自膨胀，并将工件浸入电镀溶液中，其中膨胀的掩蔽构件压在工件的特定区域上。
-
公开(公告)号：US08154849B2
公开(公告)日：2012-04-10
申请号：US12030282
申请日：2008-02-13
申请人： Tatsuo Kunishi , Yoshihiko Takano , Shigeyuki Kuroda , Akihiro Motoki , Hideyuki Kashio , Takashi Noji
发明人： Tatsuo Kunishi , Yoshihiko Takano , Shigeyuki Kuroda , Akihiro Motoki , Hideyuki Kashio , Takashi Noji
IPC分类号： H01G4/228
CPC分类号： C25D3/12 , C25D5/02 , C25D7/00 , C25D21/10 , H01G4/2325 , H01G4/30 , Y10T29/435 , Y10T29/49126 , Y10T29/49147 , Y10T29/49163 , Y10T29/49204
摘要： A laminate is prepared in which adjacent internal electrodes are electrically insulated from each other at an end surface at which the internal electrodes are exposed, a space between the adjacent internal electrodes, which is measured in the thickness direction of insulating layers, is about 10 μm or less, and a withdrawn distance of the adjacent internal electrodes from the end surface is about 1 μm or less. In an electroplating step, electroplating deposits deposited on the ends of the adjacent internal electrodes are grown so as to be connected to each other.
摘要翻译： 制备层叠体，其中相邻的内部电极在内部电极暴露的端面处彼此电绝缘，在绝缘层的厚度方向上测量的相邻内部电极之间的空间为约10μm 相邻的内部电极与端面的退出距离为1μm以下。 在电镀步骤中，沉积在相邻内部电极的端部上的电镀沉积物彼此连接。
-
公开(公告)号：US07976893B2
公开(公告)日：2011-07-12
申请号：US11133269
申请日：2005-05-20
申请人： Yoshihiko Takano , Masanori Nagao , Minoru Tachiki , Hiroshi Kawarada , Hitoshi Umezawa , Kensaku Kobayashi
发明人： Yoshihiko Takano , Masanori Nagao , Minoru Tachiki , Hiroshi Kawarada , Hitoshi Umezawa , Kensaku Kobayashi
CPC分类号： C23C16/278 , C23C16/274 , H01L39/12 , H01L39/24 , H01L2224/45144 , H01L2924/00014 , H01L2924/00 , H01L2224/48
摘要： A heavily boron-doped diamond thin film having superconductivity is deposited by chemical vapor deposition using gas mixture of at least carbon compound and boron compound, including hydrogen. An advantage of the diamond thin film deposited by the chemical vapor deposition is that it can contain boron at high concentration, especially in (111) oriented films. The boron-doped diamond thin film deposited by the chemical vapor deposition shows the characteristics of typical type II superconductor.
摘要翻译： 具有超导性的重硼掺杂金刚石薄膜通过化学气相沉积沉积，其中至少使用包含氢的碳化合物和硼化合物的气体混合物。 通过化学气相沉积沉积的金刚石薄膜的优点是它可以含有高浓度的硼，特别是在（111）取向膜中。 通过化学气相沉积沉积的掺杂硼的金刚石薄膜显示了典型的II型超导体的特性。
-
-
-
-
-
-
-
-
-
搜索结果
32 条记录 (耗时 0.184 秒)
