发明授权
- 专利标题： Semiconductor fabrication equipment
- 专利标题（中）： 半导体制造设备
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申请号： US934759申请日： 1992-10-27
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公开(公告)号： US5330577A公开(公告)日： 1994-07-19
- 发明人: Kazuo Maeda , Kouichi Ohira , Mitsuo Hirose
- 申请人： Kazuo Maeda , Kouichi Ohira , Mitsuo Hirose
- 申请人地址： JPX all of JPX all of JPX all of
- 专利权人： Semiconductor Process Laboratory Co., Inc.,Canon Sales Co., Inc.,Alcan-Tech Co., Inc.
- 当前专利权人： Semiconductor Process Laboratory Co., Inc.,Canon Sales Co., Inc.,Alcan-Tech Co., Inc.
- 当前专利权人地址： JPX all of JPX all of JPX all of
- 主分类号： H01L21/205
- IPC分类号： H01L21/205 ; C23C16/44 ; H01L21/00 ; C23C16/00
摘要：
A semiconductor fabrication apparatus for forming a film on a wafer by a CVD method provides for easy removal of the dust generated in a film-forming chamber without reducing the uptime/downtime ratio of the equipment. The apparatus includes one or more gas dispersing devices having gas releasing surfaces for releasing a reaction gas to form a film on a wafer; one or more wafer holders having wafer mounting surfaces opposed to the plane defined by the gas releasing surface; and one or more cleaners, each having a suction port and a brush connected to the suction port, provided opposing the gas releasing surface. Either the cleaner or the gas dispersing device is moved so that the brush contacts and traverses the gas releasing surface.
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