Invention Grant
- Patent Title: Ionized metal cluster beam systems and methods
- Patent Title (中): 电离金属簇束系统及方法
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Application No.: US128975Application Date: 1993-09-29
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Publication No.: US5331172APublication Date: 1994-07-19
- Inventor: Nalin Kumar , Chenggang Xie , Rama R. Goruganthu , Mohammed K. Ghazi
- Applicant: Nalin Kumar , Chenggang Xie , Rama R. Goruganthu , Mohammed K. Ghazi
- Applicant Address: TX Austin CA Los Angeles
- Assignee: Microelectronics and Computer Technology Corporation,Hughes Aircraft Company
- Current Assignee: Microelectronics and Computer Technology Corporation,Hughes Aircraft Company
- Current Assignee Address: TX Austin CA Los Angeles
- Main IPC: H01L21/60
- IPC: H01L21/60 ; H01L23/485 ; H05K3/00 ; H01J37/30
Abstract:
Ionized metal cluster beam deposition of metal bumps on substrates such as multi-chip modules and integrated circuit chips is enhanced. The present invention discloses wet etching techniques for removing unwanted metal deposited on the substrate around bumps, multiple sources for depositing alloyed (tin-lead) bumps with constant composition, and single or multiple sources for directing a cluster beam through an aperture to deposit metal on a substrate and directing an ion beam at the aperture to remove metal deposited therein.
Public/Granted literature
- US6058837A Inking device for printing machine Public/Granted day:2000-05-09
Information query
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