Invention Grant
- Patent Title: Wafer bonding using trapped oxidizing vapor
- Patent Title (中): 使用捕获的氧化蒸气晶圆接合
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Application No.: US137293Application Date: 1993-10-14
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Publication No.: US5334273APublication Date: 1994-08-02
- Inventor: John P. Short , Craig J. McLachlan , George V. Rouse , James R. Zibrida
- Applicant: John P. Short , Craig J. McLachlan , George V. Rouse , James R. Zibrida
- Applicant Address: FL Melbourne
- Assignee: Harris Corporation
- Current Assignee: Harris Corporation
- Current Assignee Address: FL Melbourne
- Main IPC: H01L21/20
- IPC: H01L21/20 ; H01L21/316 ; H01L21/762 ; B32B31/24
Abstract:
A bonding method including pressing a pair of slices together with a liquid oxidant therebetween and subjecting the pair of slices to a temperature to bond the slices together. Preferably a liquid oxidant is applied to one of the slices before they are pressed together and then dried. The heating step for bonding is carried out at a sufficiently high temperature of at least 1100.degree. C. to make the slices pliable so as to comply with each other during the bonding step.
Public/Granted literature
- US5921428A Self-metering reservoir Public/Granted day:1999-07-13
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