发明授权
US5358980A Naphthol novolac epoxy resin compositions and semiconductor devices
encapsulated therewith
失效
萘酚酚醛环氧树脂组合物和用其封装的半导体器件
- 专利标题： Naphthol novolac epoxy resin compositions and semiconductor devices encapsulated therewith
- 专利标题（中）： 萘酚酚醛环氧树脂组合物和用其封装的半导体器件
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申请号： US181540申请日： 1994-01-14
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公开(公告)号： US5358980A公开(公告)日： 1994-10-25
- 发明人: Toshio Shiobara , Kazutoshi Tomiyoshi
- 申请人： Toshio Shiobara , Kazutoshi Tomiyoshi
- 申请人地址： JPX Tokyo
- 专利权人： Shin-Etsu Chemical Company, Limited
- 当前专利权人： Shin-Etsu Chemical Company, Limited
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX3-283548 19911003
- 主分类号： C08G59/14
- IPC分类号： C08G59/14 ; C08G59/32 ; C08L63/00 ; H01B3/40 ; C08L61/06 ; C08K3/22 ; C08K3/28 ; C08L61/08 ; C08L61/12
摘要：
A thermosetting resin composition comprising (A) a naphthalene ring-bearing epoxy resin containing 1 to 10% by weight of a glycidyl naphthol derivative, (B) a naphthalene ring-bearing phenolic resin containing 1 to 10% by weight of a naphthol derivative, and (C) an inorganic filler wherein the content of the naphthol derivatives is 1 to 5% by weight based on the total resin components is suitable for encapsulating semiconductor devices since the composition has a good moldability and cures into a product having a low coefficient of expansion, heat resistance and low moisture absorption.