发明授权
- 专利标题: Chip-resistant composite coating
- 专利标题(中): 耐芯片复合涂层
-
申请号: US999385申请日: 1992-12-15
-
公开(公告)号: US5360644A公开(公告)日: 1994-11-01
- 发明人: Rodney L. Briggs , Donald H. Campbell , Mark R. Montagne
- 申请人: Rodney L. Briggs , Donald H. Campbell , Mark R. Montagne
- 申请人地址: MI Southfield
- 专利权人: BASF Corporation
- 当前专利权人: BASF Corporation
- 当前专利权人地址: MI Southfield
- 主分类号: B05D7/14
- IPC分类号: B05D7/14 ; B05D7/00 ; B05D7/24 ; C08L61/20 ; C09D133/06 ; C09D161/20 ; C09D161/32 ; C09D163/00 ; C09D201/02 ; C09D201/06 ; B05D7/16
摘要:
A coated article is described comprising a substrate having thereon a color-plus-clear composite coating wherein(a) the color layer of the composite coating is derived from a coating composition comprising:(1) a polymer component having active hydrogen-containing groups thereon,(2) an aminoplast curing agent,(3) an acid cure catalyst, and(4) an amine selected from the group consisting of substituted or unsubstituted pyridine or a substituted or unsubstituted N-alkyl primary amine, and(b) the clear layer of the composite coating is derived from a curable coating composition comprising an epoxy-functional component and an acid-functional or anhydride-functional component.
公开/授权文献
- US06042446A Perking turkey paddle 公开/授权日:2000-03-28
信息查询