公开(公告)号：US20240230017A1

公开(公告)日：2024-07-11

申请号：US18618292

申请日：2024-03-27

Applicant: KNAUF INSULATION SPRL ,  KNAUF INSULATION, INC.

Inventor： Carl HAMPSON

IPC: F16L59/02 ,  C03C13/06 ,  C03C25/32 ,  C03C25/321 ,  C03C25/34 ,  C08H8/00 ,  C08K5/17 ,  C08K7/14 ,  C08L97/02 ,  C08L99/00 ,  C08L101/02 ,  C08L101/06 ,  C09D197/02 ,  C09D199/00 ,  C09D201/02 ,  C09D201/06 ,  C09K3/00 ,  D04H1/4209 ,  D04H1/4218 ,  D04H1/64 ,  E04B1/76

CPC classification number: F16L59/028 ,  C03C13/06 ,  C03C25/32 ,  C03C25/321 ,  C03C25/34 ,  C08H8/00 ,  C08K5/175 ,  C08K7/14 ,  C08L97/02 ,  C08L99/00 ,  C08L101/025 ,  C08L101/06 ,  C09D197/02 ,  C09D199/00 ,  C09D201/025 ,  C09D201/06 ,  C09K3/00 ,  D04H1/4209 ,  D04H1/4218 ,  D04H1/64 ,  E04B1/7658 ,  E04B1/7662

Abstract: An un-reacted substantially formaldehyde free curable binder solution for binding loose mutter consists essentially of a solution obtainable by dissolving a reducing sugar, an ammonium salt acid precursor, optionally a carboxylic acid or a precursor thereof and optionally ammonia in water.

公开(公告)号：US20240230016A9

公开(公告)日：2024-07-11

申请号：US18399588

申请日：2023-12-28

Applicant: KNAUF INSULATION SPRL ,  KNAUF INSULATION, INC.

Inventor： Carl HAMPSON ,  Gert MUELLER ,  Charles APPLEY

IPC: F16L59/02 ,  C03C13/06 ,  C03C25/32 ,  C03C25/321 ,  C03C25/34 ,  C08H8/00 ,  C08K5/17 ,  C08K7/14 ,  C08L97/02 ,  C08L99/00 ,  C08L101/02 ,  C08L101/06 ,  C09D197/02 ,  C09D199/00 ,  C09D201/02 ,  C09D201/06 ,  C09K3/00 ,  D04H1/4209 ,  D04H1/4218 ,  D04H1/64 ,  E04B1/76

CPC classification number: F16L59/028 ,  C03C13/06 ,  C03C25/32 ,  C03C25/321 ,  C03C25/34 ,  C08H8/00 ,  C08K5/175 ,  C08K7/14 ,  C08L97/02 ,  C08L99/00 ,  C08L101/025 ,  C08L101/06 ,  C09D197/02 ,  C09D199/00 ,  C09D201/025 ,  C09D201/06 ,  C09K3/00 ,  D04H1/4209 ,  D04H1/4218 ,  D04H1/64 ,  E04B1/7658 ,  E04B1/7662

Abstract: A method of manufacturing a mineral fibre thermal insulation product comprises the sequential steps of:



Forming mineral fibres from a molten mineral mixture;
Spraying a substantially formaldehyde free binder solution on to the mineral fibres, the binder solution comprising: a reducing sugar, an acid precursor derivable from an inorganic salt and a source of nitrogen;
Collecting the mineral fibres to which the binder solution has been applied to form a batt of mineral fibres; and
Curing the batt comprising the mineral fibres and the binder which is in contact with the mineral fibres by passing the batt through a curing oven so as to provide a batt of mineral fibres held together by a substantially water insoluble cured binder.

公开(公告)号：US20230407134A1

公开(公告)日：2023-12-21

申请号：US18037459

申请日：2021-11-19

Applicant: Resonac Corporation

Inventor： Takahiro YAMANAKA ,  Tomohiko KOTAKE ,  Mari SHIMIZU ,  Chisato KIKKAWA ,  Ryuichiro FUKUTA ,  Yuri NAKANE

IPC: C09D201/06 ,  C09D7/63 ,  C09D7/20 ,  C09D7/61

CPC classification number: C09D201/06 ,  C09D7/63 ,  C09D7/20 ,  C09D7/61

Abstract: antifogging agent including silica particles, a hinder compound, a silane coupling agent having a polyether group, and a liquid medium.

公开(公告)号：US11186740B2

公开(公告)日：2021-11-30

申请号：US16500500

申请日：2018-03-30

Applicant: HARIMA CHEMICALS, INC.

Inventor： Takayasu Arakawa ,  Yoshiaki Yamabayashi ,  Hideyuki Goto

IPC: C09D17/00 ,  C09D201/06 ,  C08J3/20 ,  C08K3/08 ,  C08K3/36 ,  C08K3/40

Abstract: An inorganic particle dispersion having high spinnability comprises an inorganic powder, hydrophilic fumed silica, and a resin having a hydroxyl group.

公开(公告)号：US10442110B2

公开(公告)日：2019-10-15

申请号：US16170676

申请日：2018-10-25

Applicant: Koppers Performance Chemicals Inc.

Inventor： Jun Zhang ,  Xinhao H. Gao ,  John Horton ,  Richard Ziobro

IPC: B27K3/50 ,  C09D201/06 ,  B27K3/08 ,  B27K3/36 ,  B27K3/02 ,  B27K3/15 ,  C08G18/48 ,  C08G18/64 ,  C08L33/02 ,  C08L33/04 ,  C08L63/00 ,  C08L71/00 ,  C08L71/02 ,  C08L75/00 ,  C08L97/02 ,  C08L91/00

Abstract: A process is provided for treating wood products including lumber, plywood and other engineered wood products comprising the steps of contacting a composition comprising a polypropylene glycol, a high molecular weight polyethylene glycol, a polyether polyol having low solubility in water, or a polytetrahydrofuran, or hydrophobic polyether polyol, with the wood product. The invention also provides wood products comprising a polypropylene glycol, a high molecular weight polyethylene glycol, a polyether polyol having low solubility in water, or a polytetrahydrofuran, or hydrophobic polyether polyol, that have greater dimensional stability compared to an untreated wood product.

公开(公告)号：US10400139B2

公开(公告)日：2019-09-03

申请号：US15757472

申请日：2016-08-19

Applicant: NIPPON PAINT HOLDINGS CO., LTD.

Inventor： Isamu Onishi ,  Akihiro Kubo ,  Yukiko Toyota ,  Yoshinori Kushi

IPC: C09D201/02 ,  C09D201/06 ,  C09D201/08 ,  C09D101/02 ,  C08L101/02 ,  C09D7/20

Abstract: The present invention provides a coating composition which cures at low temperatures to form a cured film having high solvent resistance. The present invention provides a low-temperature-curable coating composition which comprises (A) a film-forming polymer having a hydrogen-donating functional group that has a heteroatom which bonds covalently to a hydrogen atom, (B) a film-forming polymer having a specific hydrogen-accepting functional group that has a heteroatom to which no hydrogen atom bonds covalently, and (C) a non-basic volatile solvent selected from the group consisting of a non-basic volatile solvent (C-1) having, in the molecule, both a heteroatom that bonds covalently to a hydrogen atom and a heteroatom that does not bond covalently to a hydrogen atom; a mixture of a non-basic volatile solvent (C-2) having, in the molecule, a heteroatom which bonds covalently to a hydrogen atom and a non-basic volatile solvent (C-3) having, in the molecule, a heteroatom to which no hydrogen atom bonds covalently; and combinations thereof.

公开(公告)号：US10364360B2

公开(公告)日：2019-07-30

申请号：US15329426

申请日：2015-07-30

Applicant: MITSUBISHI MATERIALS CORPORATION ,  Mitsubishi Materials Electronic Chemicals Co., Ltd.

Inventor： Masakazu Uotani ,  Hiroshi Koshiyama ,  Takeshi Kamiya ,  Tsunetoshi Honda ,  Kosei Sato ,  Masato Fujita ,  Daisuke Takano

IPC: C09D7/63 ,  C09D5/00 ,  C09D201/00 ,  A41D13/04 ,  A41D19/015 ,  A43B13/04 ,  A43B13/22 ,  A43B7/12 ,  B05D5/00 ,  B05D7/24 ,  C09D7/40 ,  C09D201/04 ,  C09D201/06 ,  C09D201/02 ,  C09D201/08 ,  B32B27/18 ,  C09D5/16 ,  C09K3/00

Abstract: A surface coating material is provided for forming a hydrophilic oil repellent layer on at least a part of the surface of a substrate, and the surface coating material includes one or more fluorine-based compounds represented by the following formulas (1) to (4), a binder, and a solvent.

公开(公告)号：US20190127540A1

公开(公告)日：2019-05-02

申请号：US16172952

申请日：2018-10-29

Applicant: Tokyo Ohka Kogyo Co., Ltd.

Inventor： Takahiro SENZAKI ,  Takashi KAMIZONO ,  Takuya NOGUCHI

IPC: C08J7/04 ,  C09D179/02 ,  C09D201/06

Abstract: To provide a surface treatment method capable of successfully making a treatment target including polyimide on a surface thereof hydrophilic or hydrophobic with a safe operation; a two-liquid type surface treatment liquid that can be suitably used for the surface treatment method; and a surface-treated polyimide product that can be obtained by the above-described surface treatment method. A first resin having a primary amino group and/or a hydroxyl group, and a secondary amino group is bonded to a surface of a treatment target including polyimide on a surface thereof, and then a second resin having a (meth)acryloyl group and/or a carbamoyl group, a hydrophilic group and/or a hydrophobic group is bonded to the first resin.

公开(公告)号：US20180277359A1

公开(公告)日：2018-09-27

申请号：US15468109

申请日：2017-03-24

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chen-Yu Liu ,  Chin-Hsiang Lin ,  Ching-Yu Chang ,  Ming-Hui Weng

IPC: H01L21/027 ,  H01L21/311 ,  C09D201/06 ,  G03F7/11 ,  G03F7/16 ,  G03F7/09

Abstract: Under layer composition and methods of manufacturing semiconductor devices are disclosed. The method of manufacturing semiconductor device includes the following steps. A layer of an under layer composition is formed, wherein the under layer composition includes a polymeric material and a cross-linker, and the cross-linker includes at least one decomposable functional group. A curing process is performed on the layer of the under layer composition to form an under layer, wherein the cross-linker is crosslinked with the polymeric material to form a crosslinked polymeric material having the at least one decomposable functional group. A patterned photoresist layer is formed over the under layer. An etching process is performed to transfer a pattern of the patterned photoresist layer to the under layer. The under layer is removed by decomposing the decomposable functional group.

公开(公告)号：US20180141313A1

公开(公告)日：2018-05-24

申请号：US15814948

申请日：2017-11-16

Applicant: The Board of Trustees of the University of Illinois

Inventor： Scott R. WHITE ,  Nancy R. Sottos ,  Michael T. Odarczenko

IPC: B32B15/092 ,  C09D163/04 ,  C08L63/00 ,  C08L79/02 ,  C08K5/00 ,  B32B15/18 ,  C08J3/24 ,  C09D201/06

CPC classification number: B32B15/092 ,  B32B15/18 ,  C08J3/246 ,  C08K5/0025 ,  C08K5/0091 ,  C08K9/10 ,  C08L63/00 ,  C08L79/02 ,  C08L2205/05 ,  C08L2207/53 ,  C09D163/00 ,  C09D163/04 ,  C09D201/06

Abstract: The corrosion of unprotected steel substrates causes damage that is costly to repair or replace. Current protective coatings predominately rely on environmentally harmful anticorrosive agents and toxic solvents to protect the underlying substrate. The use of lawsone (2-hydroxy-1,4-napthoquinone) together with a environmentally benign epoxy coating provides an environmentally-friendly alternative for common protective coatings. Microencapsulated lawsone embedded coatings allows the anticorrosive agent to remain dormant until released by damage and is then deposited directly onto the steel substrate. Both visual and electrochemical analysis shows that this self-protective scheme leads to 60% corrosion inhibition in a neutral salt water solution.