A recloseable package having recloseable profile strips with a heat barrier is disclosed. The profile strips have flange elements and recloseable , mated profile strips. The package is made by providing mated top and bottom profile strips, providing top and bottom package films on opposite sides of the mated strips and applying heat and pressure to the films adjacent the flanges sufficient to simultaneously form heat seals respectively between the top film and the top profile strip flange and between the bottom film and bottom profile strip flange. The heat barrier may comprise a thickened flange element, buffer strip or a coextrusion of high temperature resin on the inside layer of the flange element. The heat barrier prevents the flanges from fusing together during the formation of flange-film seals.