An improvement is proposed in a frame-supported pellicle, i.e. a thin transparent film of a polymeric resin adhesively bonded to a frame member, used for dust-proof protection of a photomask in a photolithographic patterning work for the manufacture of electronic devices. The improvement comprises using, as the adhesive, an organopolysiloxane-based composition which comprises (a) a perfluoroalkyl-containing diorganopolysiloxane having at least two vinyl groups per molecule, (b) an organohydrogenpolysiloxane having at least one epoxy group and (c) a platinum catalyst for promoting the hydrosilation reaction between (a) and (b). As compared with conventional adhesives, a quite good adhesive bonding strength can be obtained with this adhesive even when the membrane is made from a fluorocarbon group-containing polymeric resin and the adhesive layer obtained therefrom is highly resistant against ultraviolet irradiation to ensure a long serviceable life of the pellicle.