公开(公告)号：US20220073801A1

公开(公告)日：2022-03-10

申请号：US17417967

申请日：2019-12-25

申请人： NISSAN CHEMICAL CORPORATION

发明人： Hiroshi OGINO ,  Tetsuya SHINJO ,  Ryo KARASAWA ,  Takahisa OKUNO

IPC分类号： C09J183/14 ,  C09J5/00 ,  C09J11/04 ,  C08G77/50 ,  C08K3/04 ,  H01L21/683 ,  H01L23/00 ,  B32B37/12 ,  B32B43/00

摘要： An adhesive composition for use in debonding with light irradiation, which composition can achieve debonding through irradiation with light, wherein the adhesive composition contains an adhesive component and carbon black, and the adhesive component contains a component (A) which is cured through hydrosilylation.

公开(公告)号：US11186757B2

公开(公告)日：2021-11-30

申请号：US16074187

申请日：2017-02-03

申请人： Toray Industries, Inc.

发明人： Shinji Arimoto ,  Takenori Fujiwara ,  Toru Okazawa

IPC分类号： C09J179/08 ,  C08G77/18 ,  C08G77/20 ,  C08G77/26 ,  C08K3/36 ,  C08K5/1539 ,  C08L63/00 ,  C08L79/08 ,  C09J11/06 ,  C08G73/10 ,  C09J183/14 ,  C08G77/455 ,  H01L21/683

摘要： A resin composition contains at least (a) a polyimide resin having a specific structure and (b) a crosslinker including a fluorene group. The resin composition is capable of bonding an electronic circuit formation substrate or a semiconductor circuit formation substrate and a support substrate together. The resin composition has excellent heat resistance during bonding of an electronic circuit formation substrate or semiconductor circuit formation substrate having a thickness of 1 μm or more and 100 μm or less. The resin composition has steady adhesive force through the process of manufacturing an electronic component, a semiconductor device or the like, and can be peeled off under mild conditions at room temperature after the manufacturing process. An adhesive, a resin layer, a laminated film, and a processed wafer containing the resin composition, as well as a method for manufacturing an electronic component or a semiconductor device using these are also disclosed.

公开(公告)号：US10563011B2

公开(公告)日：2020-02-18

申请号：US14210851

申请日：2014-03-14

申请人： Benedict S. Curatolo

发明人： Benedict S. Curatolo

IPC分类号： C08G63/695 ,  C08G63/78 ,  C08G63/00 ,  C08L63/00 ,  C09D163/00 ,  C09J163/00 ,  C09D4/00 ,  C08G59/00 ,  C08G77/54 ,  C08K3/22 ,  C08K3/32 ,  C08K3/36 ,  C08K5/375 ,  C09D5/08 ,  C09D167/00 ,  C09D183/14 ,  C09J167/00 ,  C09J183/14 ,  C08F230/08 ,  C08F220/34 ,  C08F222/10 ,  C07F7/08

摘要： A dual curable composition is provided, comprising a compound represented by formula (I): (acrylate)a-(A)-(silane)b  (I) in which a and b are identical or different and are each represented by an integer greater than or equal to 1; and wherein the dual curable composition is radiation curable and/or moisture curable. The moiety A comprises at least one of an aliphatic hydrocarbon, a cycloaliphatic hydrocarbon, an aryl moiety, an ether, an ester, an amide, a urethane, a urea, a hydroxyl group-containing organic moiety, an acrylic oligomer, an epoxy oligomer, a urethane oligomer, a polyester oligomer, or mixtures thereof, and the dual curable composition has a molecular weight greater than or equal to 300.

公开(公告)号：US10479913B2

公开(公告)日：2019-11-19

申请号：US15518660

申请日：2015-09-28

申请人： Dow Corning Corporation

发明人： Kyungdong Han ,  Gunn Jo ,  Bokyung Kim

IPC分类号： C09J7/38 ,  C08K3/36 ,  C09J183/14

摘要： A pressure sensitive adhesive film comprises a substrate film and a pressure sensitive adhesive (PSA) layer formed on a surface of the substrate film. The PSA layer is formed from a silicone composition comprising: a diorganopolysiloxane having at least two alkenyl groups in a molecule and having a viscosity at 25° C. of from 10,000 to 1,000,000 mPa·s; (B) a diorganopolysiloxane having at least one alkenyl group in a molecule, and being raw and rubber-like at 25° C. or having a viscosity at 25° C. of more than 1,000,000 mPa·s; (C) an organopolysiloxane resin represented by the following average unit formula: (R13SiO1/2)x(SiO4/2)1.0, wherein each R1 represents a halogen-substituted or unsubstituted monovalent hydrocarbon group free from an alkenyl group and x is a number from 0.5 to 1.0; (D) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (E) silica fine powder; and (F) a hydrosilylation catalyst.

公开(公告)号：US10453732B2

公开(公告)日：2019-10-22

申请号：US15360418

申请日：2016-11-23

申请人： SHIN-ETSU CHEMICAL CO., LTD.

发明人： Hiroyuki Yasuda ,  Michihiro Sugo ,  Hideto Kato

IPC分类号： H01L21/683 ,  H01L21/304 ,  H01L23/00 ,  C09J165/00 ,  C09J183/14 ,  C09D5/32 ,  C09D165/00 ,  C09D183/14 ,  C09J5/00 ,  C08G77/52 ,  C08K5/00 ,  C08L63/00

摘要： A wafer laminate has an adhesive layer (3) sandwiched between a transparent substrate (1) and a water (2), with a circuit-forming surface of the wafer facing the adhesive layer. The adhesive layer (3) includes a first cured resin layer (3a) disposed adjacent the substrate and having light-shielding properties and a second cured resin layer (3b) disposed adjacent the wafer and comprising a cured product of a thermosetting resin composition.

公开(公告)号：US09944758B2

公开(公告)日：2018-04-17

申请号：US14766769

申请日：2014-02-10

申请人： Dow Corning Corporation

发明人： Jing Jiang ,  Kristen Steinbrecher ,  Yin Tang ,  James Tonge ,  Lauren Tonge ,  Afrooz Zarisfi

IPC分类号： C08J3/20 ,  C08G77/14 ,  C09J183/06 ,  C09J183/14 ,  C08L83/06 ,  C08L83/14 ,  C08G77/06 ,  C08K3/22 ,  C08G77/12 ,  C08G77/20

CPC分类号： C08G77/14 ,  C08G77/06 ,  C08G77/12 ,  C08G77/20 ,  C08K3/22 ,  C08K2003/2265 ,  C08L83/06 ,  C08L83/14 ,  C09J183/06 ,  C09J183/14

摘要： A hydrosilylation process is used to prepare a clustered functional polyorganosiloxane. The clustered functional polyorganosiloxane comprises a reaction product of a reaction of a) a polyorganosiloxane having an average, per molecule, of at least 2 aliphatically unsaturated organic groups; b) a polyorganohydrogensiloxane having an average of 4 to 15 silicon atoms per molecule; and c) a reactive species having, per molecule at least 1 aliphatically unsaturated organic group and 1 or more radical curable groups selected from an acrylate group and a methacrylate group; in the presence of d) a hydrosilylation catalyst, and e) an isomer reducing agent. The weight percent of silicon bonded hydrogen atoms in component b) divided by the weight percent of aliphatically unsaturated organic groups in component a) (the SiHb/Via ratio) ranges from 4/1 to 20/1. The resulting clustered functional polyorganosiloxane is useful in a curable silicone composition for electronics applications.

公开(公告)号：US20170253965A1

公开(公告)日：2017-09-07

申请号：US15523353

申请日：2015-10-29

申请人： DIC Corporation

发明人： Yasuhiro TAKADA ,  Takayuki MIKI ,  Naoto YAGI ,  Kenichiro OKA ,  Hideki TORII ,  Shinichi KUDO

IPC分类号： C23C16/40 ,  C09J11/04 ,  C09D183/14 ,  C09D7/12 ,  C09J183/14 ,  C09D5/00

CPC分类号： C23C16/40 ,  B32B9/04 ,  B32B27/00 ,  B32B27/30 ,  C08G77/442 ,  C08J7/045 ,  C08J2369/00 ,  C08J2451/08 ,  C08J2483/10 ,  C08K3/36 ,  C09D5/002 ,  C09D7/61 ,  C09D183/14 ,  C09J11/04 ,  C09J183/14 ,  C23C16/401

摘要： There is provided a layered body including a resin layer and a second layer that are stacked on one another. The resin layer is formed of a resin composition containing a fine inorganic particle composite that includes: a composite resin in which a polysiloxane segment having a structural unit represented by general formula and/or general formula and further having a silanol group and/or a hydrolyzable silyl group is bonded to a vinyl-based polymer segment through a bond represented by general formula; and fine inorganic particles that are each bonded to the composite resin at the polysiloxane segment through a siloxane bond.

公开(公告)号：US09752007B2

公开(公告)日：2017-09-05

申请号：US14418464

申请日：2013-05-31

申请人： DOW CORNING CORPORATION

发明人： Dorab Edul Bhagwagar ,  Jeffrey Krzywosinski ,  Kai Su

IPC分类号： C08L83/14 ,  C08G77/14 ,  C08G77/50 ,  C08K3/22 ,  C09J183/14

CPC分类号： C08K3/22 ,  C08G77/14 ,  C08G77/50 ,  C08K2003/2227 ,  C08K2201/001 ,  C08L83/14 ,  C09J183/14

摘要： A composition comprises (A) a condensation reaction catalyst, (B) a polyorganosiloxane having an average, per molecule, of at least two hydrolyzable substituents, (C) a crosslinker, and (D) a thermally conductive filler. The polyorganosiloxane may be silanol terminated, and the crosslinker may be an alkoxysilylhydrocarbylene functional polyorganosiloxane. The composition is capable of reacting via condensation reaction to form a thermally conductive product. The composition and product are useful for thermal management in (opto)electronics applications.

公开(公告)号：US09718925B2

公开(公告)日：2017-08-01

申请号：US14766775

申请日：2014-02-10

申请人： Dow Corning Corporation

发明人： Jing Jiang ,  Yin Tang ,  James Tonge ,  Afrooz Zarisfi

IPC分类号： C08G77/08 ,  C08G77/04 ,  C09J183/06 ,  C09J183/14 ,  C08L83/06 ,  C08L83/14 ,  C09J183/04 ,  C09K5/14 ,  C08G77/12 ,  C08G77/14 ,  C08G77/20

CPC分类号： C08G77/04 ,  C08G77/12 ,  C08G77/14 ,  C08G77/20 ,  C08L83/06 ,  C08L83/14 ,  C09J183/04 ,  C09J183/06 ,  C09J183/14 ,  C09K5/14

摘要： A curable silicone composition is provided that comprises a reaction product of a reaction of (I) a clustered functional polyorganopolysiloxane having at least one radical curable group selected from an acrylate group and a methacrylate group; (II) a silicone reactive diluent, and a (III) a radical initiator.

公开(公告)号：US09670392B2

公开(公告)日：2017-06-06

申请号：US14766770

申请日：2014-02-10

申请人： Dow Corning Corporation

发明人： Kent Larson ,  Kristen Steinbrecher ,  James Tonge ,  Afrooz Zarisfi

IPC分类号： B05D3/02 ,  C08G77/12 ,  C08G77/14 ,  C08G77/18 ,  C08G77/20 ,  C08K3/22 ,  C08L83/06 ,  C08L83/14 ,  C09J133/14 ,  C09J183/06 ,  C09J183/14

CPC分类号： C09J183/06 ,  B05D3/0272 ,  C08G77/12 ,  C08G77/14 ,  C08G77/18 ,  C08G77/20 ,  C08K3/22 ,  C08K2003/2265 ,  C08L83/06 ,  C08L83/14 ,  C09J133/14 ,  C09J183/14

摘要： A stable thermal radical curable silicone composition is provided that comprises (I) a clustered functional polyorganopolysiloxane having one or more radical curable groups selected from an acrylate group and a methacrylate group; (II) a reactive resin and polymer; (III) a radical initiator; (IV) a moisture cure initiator; and (V) a crosslinker. The reactive resin and polymer includes (a) an organopolysiloxane polymer and (b) an alkoxy-functional organopolysiloxane resin. The alkoxy-functional organopolysiloxane resin comprises the reaction product of a reaction of (i) an alkenyl-functional siloxane resin, (ii) an alkoxysilane-functional organosiloxane, and (iii) an endcapper in the presence of (iv) hydrosilylation catalyst. The stable thermal radical curable silicone composition can be utilized for electronics applications.