A process for producing a resin compound applicable to precise electronic parts, especially sliding member from thermoplastic engineering plastics is disclosed, comprising compounding (I) a carbon masterbatch comprising polyethylene having a density of not less than 0.92 g/cm.sup.3 and an MI of from 0.1 to 30 g/10 min, conductive carbon black, and talc and (II) a thermoplastic engineering plastic. The carbon black is satisfactorily dispersed to impart satisfactory heat conductivity to a molded article to thereby providing a sliding member with little wear and long durability.