发明授权
- 专利标题: Fabricating porous silicon carbide
- 专利标题(中): 制造多孔碳化硅
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申请号: US159375申请日: 1993-11-30
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公开(公告)号: US5376241A公开(公告)日: 1994-12-27
- 发明人: Joseph S. Shor , Anthony D. Kurtz
- 申请人: Joseph S. Shor , Anthony D. Kurtz
- 申请人地址: NJ Leonia
- 专利权人: Kulite Semiconductor Products, Inc.
- 当前专利权人: Kulite Semiconductor Products, Inc.
- 当前专利权人地址: NJ Leonia
- 主分类号: H01L21/465
- IPC分类号: H01L21/465 ; H01L21/76 ; H01L29/24 ; H01L29/861 ; H01L33/00 ; H01L33/34 ; C25F3/12
摘要:
The formation of porous SiC occurs under electrochemical anodization. A sample of SiC is contacted electrically with nickel and placed into an electrochemical cell which cell includes a counter electrode and a reference electrode. The sample is encapsulated so that only a bare semiconductor surface is exposed. The electrochemical cell is filled with an HF electrolyte which dissolves the SiC electrochemically. A potential is applied to the semiconductor and UV light illuminates the surface of the semiconductor. By controlling the light intensity, the potential and the doping level, a porous layer is formed in the semiconductor and thus one produces porous SiC.
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