发明授权
- 专利标题： Method of preparing a large-current printed circuit board
- 专利标题（中）： 制备大电流印刷电路板的方法
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申请号： US72154申请日： 1993-06-04
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公开(公告)号： US5381598A公开(公告)日： 1995-01-17
- 发明人: Einosuke Adachi , Yasumichi Hatanaka , Kiroyuki Nakajima , Satoru Hayashi
- 申请人： Einosuke Adachi , Yasumichi Hatanaka , Kiroyuki Nakajima , Satoru Hayashi
- 申请人地址： JPX Tokyo
- 专利权人： Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人： Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX3-275146 19911023
- 主分类号： F16B19/10
- IPC分类号： F16B19/10 ; H01R9/20 ; H01R12/58 ; H01R43/20 ; H05K1/02 ; H05K1/18 ; H05K3/32 ; H05K7/06 ; H01R9/09 ; H01R4/02 ; H05K3/34
摘要：
A method of preparing a large-current printed circuit board comprises inserting a fastener with a bottom flange in a through-hole formed in a printed circuit board so that the bottom flange is engaged with a surface of the printed circuit board, putting a washer having substantially the same outer diameter so the flange around the fastener at the other surface of the board, forming a radial extension at the outer side of the washer by caulking the fastener, whereby the fastener is fixed to the printed circuit board by means of the radial extension and the bottom flange wherein the washer is interposed between the radial extension and the printed circuit board.