发明授权
- 专利标题: Packaging of high power semiconductor lasers
- 专利标题(中): 大功率半导体激光器的封装
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申请号: US91657申请日: 1993-07-14
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公开(公告)号: US5392305A公开(公告)日: 1995-02-21
- 发明人: Paul A. Jakobson
- 申请人: Paul A. Jakobson
- 申请人地址: NY Corning
- 专利权人: Corning Incorporated
- 当前专利权人: Corning Incorporated
- 当前专利权人地址: NY Corning
- 主分类号: H01L33/48
- IPC分类号: H01L33/48 ; H01S5/00 ; H01S5/022 ; H01S3/19
摘要:
A package for a high power semiconductor laser comprising a hermetically sealed container filled with a dry gaseous medium containing oxygen. The presence of oxygen in the laser atmosphere is counter to standard practice in the art which teaches the use of an atmosphere of a dry inert gas.
公开/授权文献
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