Provided is a composite material comprising a carrier, a conductive layer formed on the carrier, and a dielectric layer containing spacer particles formed on the conductive layer. The dielectric layer has an abrasion factor less than about 0.3 determined by a brass shim abrasion method, and a substantially uniform distribution of spacer particles substantially free of flat spots greater than about 100 microns in the x-y direction and 1500 square microns in area on any part of the surface. The spacer particles of the dielectric layer of the composite material preferably are amorphous silica. The composite material is useful in electrostatic imaging technology and provides images substantially free of defects, including artifacts or flares, dropouts and nib writing.Also provided is a process which permits the creation of very stable dispersions of solid particles in a dispersing medium useful for both the dielectric and conductive layers of the composite material of the invention.A white or colored conductive ground plane is also provided.