发明授权
- 专利标题: Method of manufacturing electronic elements
- 专利标题(中): 电子元件制造方法
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申请号: US247523申请日: 1994-05-23
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公开(公告)号: US5424093A公开(公告)日: 1995-06-13
- 发明人: Koichi Nitta , Michio Kaeriyama , Kazuma Kabuta , Haruo Hori , Masami Yamaguchi , Tadahiro Nakagawa
- 申请人: Koichi Nitta , Michio Kaeriyama , Kazuma Kabuta , Haruo Hori , Masami Yamaguchi , Tadahiro Nakagawa
- 申请人地址: JPX Nagaokakyo
- 专利权人: Murata Mfg. Co., Ltd.
- 当前专利权人: Murata Mfg. Co., Ltd.
- 当前专利权人地址: JPX Nagaokakyo
- 优先权: JPX3-328055 19911115; JPX3-328056 19911115
- 主分类号: B05D1/18
- IPC分类号: B05D1/18 ; H01G4/232 ; H05K1/09 ; H05K3/34 ; H05K3/40 ; B05D5/12 ; B05D1/36
摘要:
A thick layer of electrode material paint is formed on a flat surface. A film of the electrode material paint is formed on an element by dipping the element into the layer. In the next step, a thinner layer of the electrode material paint than the aforementioned layer is formed on a flat surface. Into the thinner layer of the electrode material paint, the film of the electrode material paint formed on the element is dipped. Alternatively, the element may first be dipped into a thinner layer of the electrode material paint so that a thin film of the electrode material paint is formed on the element. The film formed on the element is then dipped into a thick layer of the electrode material paint and then again into a thin layer of the electrode material paint in such order. By firing the film of the electrode material paint obtained in this manner, an electronic element having external electrodes of a uniform thickness can be obtained.
公开/授权文献
- US6111798A Fuse repair circuit for semiconductor memory circuit 公开/授权日:2000-08-29
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