Invention Grant
- Patent Title: Lead frame including an inductor or other such magnetic component
- Patent Title (中): 引线框架包括电感器或其他这样的磁性部件
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Application No.: US239346Application Date: 1994-05-06
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Publication No.: US5428245APublication Date: 1995-06-27
- Inventor: Peng-Cheng Lin , Seth R. Sanders , Hem P. Takiar
- Applicant: Peng-Cheng Lin , Seth R. Sanders , Hem P. Takiar
- Applicant Address: CA Santa Clara
- Assignee: National Semiconductor Corporation
- Current Assignee: National Semiconductor Corporation
- Current Assignee Address: CA Santa Clara
- Main IPC: G01R1/20
- IPC: G01R1/20 ; H01L23/495 ; H01L23/48
Abstract:
A lead frame for use in an integrated circuit package is disclosed herein. The lead frame includes a magnetic component winding wherein the winding is formed as an integral part of the lead frame. Additional windings may be formed as an integral part of the lead frame and then folded into position over the first winding to form a multiple layered magnetic component winding. In one embodiment, the lead frame based winding is coated with a magnetic material to form a lead frame based inductor. There is also disclosed a method of producing a lead frame including a magnetic component winding wherein the winding is formed as an integral part of the lead frame.
Public/Granted literature
- US6095322A Modular belting for use in the food processing industry Public/Granted day:2000-08-01
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