利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

84 条记录 (耗时 0.017 秒)

    Memory card with and without enclosure
    2.
    发明授权
    Memory card with and without enclosure 有权
    带和不带外壳的存储卡

    公开(公告)号：US07416132B2

    公开(公告)日：2008-08-26

    申请号：US10851466

    申请日：2004-05-20

    申请人： Hem P. Takiar ,  Robert Miller

    发明人： Hem P. Takiar ,  Robert Miller

    IPC分类号： G06K19/06

    CPC分类号： G06K19/07732 ,  G06K13/0825 ,  G06K19/077 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01004 ,  H01L2924/1815 ,  H01L2924/19041 ,  H05K1/02 ,  H05K1/0268 ,  H05K1/117 ,  H05K3/284 ,  H05K2201/09045 ,  H05K2201/09154 ,  H05K2203/0271 ,  Y10T29/4913 ,  H01L2924/00014

    摘要： The present invention, roughly described, pertains to a small memory card that includes features which allow the memory card to be more easily handled by a user. In various embodiments, the memory card can include a chamfer and/or a raised portion that allows the memory card to be more easily grabbed by a human hand (or mechanical device) and also provides additional room to store passive devices such as capacitors and/or resistors. Because different electronic devices use different types of memory cards, an adaptor is provided that allows the memory cards disclosed herein to be used in ports or connectors on electronic devices that are meant for other types of memory cards.

    摘要翻译： 大致描述的本发明涉及一种小型存储卡，其包括允许存储卡更容易由用户处理的特征。 在各种实施例中，存储卡可以包括倒角和/或凸起部分，其允许存储卡被人的手（或机械装置）更容易地抓住，并且还提供额外的空间以存储诸如电容器和/ 或电阻。 因为不同的电子设备使用不同类型的存储卡，所以提供了一种适配器，其允许本文所公开的存储卡被用在用于其他类型的存储卡的电子设备上的端口或连接器中。

    Chip scale package with compliant leads
    7.
    发明授权
    Chip scale package with compliant leads 有权
    芯片级封装符合引脚

    公开(公告)号：US06521970B1

    公开(公告)日：2003-02-18

    申请号：US09653820

    申请日：2000-09-01

    申请人： Hem P. Takiar ,  Nikhil Vishwanath Kelkar

    发明人： Hem P. Takiar ,  Nikhil Vishwanath Kelkar

    IPC分类号： H01L2900

    CPC分类号： H01L24/12 ,  H01L23/3114 ,  H01L24/11 ,  H01L2224/0231 ,  H01L2224/02335 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05666 ,  H01L2224/13099 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/013

    摘要： A wafer level fabricated chip scale integrated circuit package having an air gap formed between the integrated circuit die of the package and compliant leads located over and conductively attached to the die is described. Contact bumps offset on the compliant leads provide for connection of the integrated circuit package to other substrates. In some embodiments, the compliant leads include a conductive layer overlaid with an outer resilient layer, and may further include an inner resilient layer beneath the conductive layer. The outer resilient layer has a via formed through it exposing the underlying conductive layer. The via is offset along the compliant lead a horizontal distance from the bond pad to which the compliant lead is conductively coupled. The chip scale package provides a highly compliant connection between the die and any substrate that the die is attached to.

    摘要翻译： 描述了一种晶片级制造的芯片级集成电​​路封装，其具有形成在封装的集成电路管芯之间的空气间隙和位于管芯上并导电地附接于管芯的柔性引线。 柔性引线上的接触凸块偏移可提供集成电路封装与其他基板的连接。 在一些实施例中，柔性引线包括覆盖有外部弹性层的导电层，并且还可以包括导电层下面的内部弹性层。 外部弹性层具有通过其形成的通孔，其暴露下面的导电层。 通孔沿柔性引线偏离与接合焊盘的水平距离，其中顺应引线与导电耦合。 芯片尺寸封装提供了管芯与管芯所连接的任何衬底之间高度兼容的连接。

    Method of packaging fuses
    8.
    发明授权
    Method of packaging fuses 失效
    包装保险丝的方法

    公开(公告)号：US06459143B2

    公开(公告)日：2002-10-01

    申请号：US09844062

    申请日：2001-04-26

    申请人： Inderjit Singh ,  Hem P. Takiar ,  Ranjan J. Mathew ,  Nikhil V. Kelkar

    发明人： Inderjit Singh ,  Hem P. Takiar ,  Ranjan J. Mathew ,  Nikhil V. Kelkar

    IPC分类号： H01L2358

    CPC分类号： H01L23/62 ,  H01L2224/13

    摘要： Improved methods of packaging external fuses together with integrated circuit devices are described. A pair of frame strips are provided that each have an associated set of contact pads. A resistor paste is applied to one of the contact pad sets and the frame strips are laminated together by curing the resistor paste which is positioned between the contact pad sets. Dice are mounted to the opposite sides of the second contact pads to form integrated circuit devices having integrally packaged external fuses. The packaged devices are eventually singulated for use. In some embodiments, the contact pads each have downturned tabs that form wings on opposite sides of each die. When the dice are flip chips, a device may be attached to a substrate board by soldering both the bumps on the die and the tab wing tips to the substrate board. In a preferred embodiment, the resistor paste is a positive temperature coefficient resistor paste.

    摘要翻译： 描述了与集成电路器件一起封装外部保险丝的改进方法。 提供了一对框带，每个框带具有一组相关的接触垫。 将电阻浆料施加到接触垫组中的一个，并且通过固化位于接触垫组之间的电阻浆料将框带层压在一起。 骰子安装到第二接触焊盘的相对侧，以形成具有整体封装的外部熔断器的集成电路器件。 封装的装置最终被单独使用。 在一些实施例中，接触垫每个都具有在每个管芯的相对侧上形成翅膀的下降的突片。 当芯片是倒装芯片时，可以通过将裸片上的凸起和凸片翼尖焊接到基板来将装置附接到基板。 在优选实施例中，电阻膏是正温度系数电阻膏。

    Connection assembly for reflective liquid crystal projection with branched PCB display
    9.
    发明授权
    Connection assembly for reflective liquid crystal projection with branched PCB display 有权
    具有分支PCB显示的反射液晶投影连接组件

    公开(公告)号：US06384890B1

    公开(公告)日：2002-05-07

    申请号：US09440218

    申请日：1999-11-15

    申请人： Hem P. Takiar ,  Ranjan J. Mathew

    发明人： Hem P. Takiar ,  Ranjan J. Mathew

    IPC分类号： G02F11345

    CPC分类号： G02F1/13452 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H04N9/3105 ,  H04N9/317 ,  H05K1/118 ,  H05K3/361 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A connection assembly (40) for operably coupling a plurality of independent imaging devices (41, 41′, 41″) to an optical subsystem (42). The connection assembly (40) includes a unitary flex circuit device (43) having an elongated arm portion (45), and a plurality independent finger portions (46, 46′, 46″) extending from a distal end of the arm portion (45). Each finger portion (46, 46′, 46″) defines a coupling region (47, 47′, 47″) adapted to operably couple a respective imaging device (41, 41′, 41″) to a respective finger portion (46, 46′, 46″) for support thereof. The finger portions (46, 46′, 46″) are further adapted to strategically couple each respective imaging device (41, 41′, 41″) to the optical subsystem (42) as a unit. The flex circuit device (30) includes a plurality of circuits (65) terminating at respective terminals (40) of a coupling region (47) thereof. The terminals (66) supportively and communicably coupled to the bond pads (67) of the die (58) for support thereof. The coupling region (47) further includes an adhesive mount (76) mounting the flex circuit device (43) to the transparent plate to supportably suspend the display assembly (57) between the die (58) and the transparent plate (61).

    摘要翻译： 一种用于将多个独立成像装置（41,41'，41“）可操作地耦合到光学子系统（42）的连接组件（40）。 连接组件（40）包括具有细长臂部分（45）的单一柔性电路装置（43）和从臂部分的远端延伸的多个独立的指状部分（46,46'，46“） 45）。 每个指部分（46,46'，46“）限定适于将相应的成像装置（41,41'，41”）可操作地耦合到相应的手指部分的耦合区域（47,47'，47“） （46,46'，46“），用于支撑它。 手指部分（46,46'，46“）还适于将每个相应的成像装置（41,41'，41”）策略性地耦合到作为一个单元的光学子系统（42）。 柔性电路装置（30）包括终止于其耦合区域（47）的各个端子（40）处的多个电路（65）。 端子（66）支撑并可通信地耦合到模具（58）的接合焊盘（67）以用于其支撑。 耦合区域（47）还包括将柔性电路装置（43）安装到透明板上以将显示组件（57）可支撑地悬挂在模具（58）和透明板（61）之间的粘合剂安装件（76）。

    Manufacturing methods and construction for integrated circuit packages
    10.
    发明授权
    Manufacturing methods and construction for integrated circuit packages 失效
    集成电路封装的制造方法和结构

    公开(公告)号：US06362530B1

    公开(公告)日：2002-03-26

    申请号：US09056074

    申请日：1998-04-06

    申请人： Shaw Wei Lee ,  Hem P. Takiar

    发明人： Shaw Wei Lee ,  Hem P. Takiar

    IPC分类号： H01L2348

    CPC分类号： H01L23/49816 ,  H01L23/057 ,  H01L23/3675 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/16251 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/0401

    摘要： A method of forming an integrated circuit package includes providing a flip chip integrating circuit die having a first plurality of contacts for electrically connecting the die to other elements. A second plurality of contacts for electrically connecting the integrated circuit package to external elements is also provided. A substrate for supporting the flip chip die and the second plurality of contacts is initially prepared. The substrate includes a connecting arrangement for electrically connecting the first plurality of contacts on the die to the second plurality of contacts. The method includes the step positioning the flip chip integrated circuit die and the second plurality of contacts on the substrate. With the flip chip die and the second plurality of contacts in position, both the first plurality of contacts on the flip chip die and the second plurality of contacts are simultaneously attached to the substrate thereby electrically connecting the die and the second plurality of contacts to the substrate. In one embodiment, a metal cap is attached to the integrated circuit package to cover and protect the die. In this embodiment, the metal cap may be used to provide a direct thermal path from the die to the external element to which the integrated circuit package is to the connected. An additional heat sink may also be attached to the package.

    摘要翻译： 形成集成电路封装的方法包括提供具有第一多个触点的倒装芯片集成电路管芯，用于将管芯电连接到其它元件。 还提供了用于将集成电路封装电连接到外部元件的第二多个触点。 最初准备了用于支撑倒装芯片模具和第二多个触点的基板。 基板包括用于将模具上的第一多个触点电连接到第二多个触点的连接装置。 该方法包括将倒装芯片集成电路管芯和第二多个触点定位在衬底上的步骤。 通过倒装晶片管芯和第二组触头就位，倒装晶片管芯上的第一个多个触点和第二个多个触头都同时附着在基板上，从而将管芯和第二个多个触头电连接到 基质。 在一个实施例中，金属盖连接到集成电路封装以覆盖和保护管芯。 在该实施例中，金属盖可用于提供从模具到集成电路封装件所连接的外部元件的直接热路径。 附加的散热器也可以附接到包装上。