发明授权
- 专利标题： Electronic components mounting base material
- 专利标题（中）： 电子元件安装基材
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申请号： US773818申请日： 1991-10-09
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公开(公告)号： US5437921A公开(公告)日： 1995-08-01
- 发明人: Yasuo Kogo , Takefumi Ito , Mitsuhiro Okumura , Kiyoshi Yoshizaki , Takeji Fujihara , Hirofumi Yamashita
- 申请人： Yasuo Kogo , Takefumi Ito , Mitsuhiro Okumura , Kiyoshi Yoshizaki , Takeji Fujihara , Hirofumi Yamashita
- 申请人地址： JPX Tokyo
- 专利权人： Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人： Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX2-272666 19901009
- 主分类号： C22C49/00
- IPC分类号： C22C49/00 ; C22C47/00 ; C22C49/06 ; C22C49/14 ; H01L23/14 ; H01L23/373 ; H01L23/492 ; H05K1/05 ; B32B5/06
摘要：
A base material for mounting electronic components is provided which has a low density and a coefficient of thermal expansion close to that of aluminum and can be processed with ease. The base material essentially consists of aluminum or an aluminum alloy reinforced with carbon fibers with a volume fraction ranging from 0.15 to 0.55, the carbon fibers in the base material being arranged at random on a surface for mounting an electronic component and being arranged in layer in a direction vertical to the above-described surface.
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