发明授权
- 专利标题： Resin-packaged semiconductor device with flow prevention dimples
- 专利标题（中）： 具有流动防止凹坑的树脂封装半导体器件
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申请号： US177380申请日： 1994-01-05
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公开(公告)号： US5440169A公开(公告)日： 1995-08-08
- 发明人: Yoshihiro Tomita , Shunichi Abe
- 申请人： Yoshihiro Tomita , Shunichi Abe
- 申请人地址： JPX Tokyo
- 专利权人： Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人： Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX5-002092 19930108
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; H01L23/28 ; H01L23/31 ; H01L23/433 ; H01L23/495 ; H01L23/50 ; H05K1/02 ; H05K1/18 ; H05K3/34 ; H01L23/48
摘要：
A resin-packaged semiconductor device having a semiconductor element mounted on a first surface of a mounting pad. The mounting pad has an edge molded in a frame-shaped portion of a molding material. A second surface of the mounting pad has a central portion that is not included in the edge of the mounting pad and that is not covered with the molding material, the central portion of the second surface being exposed at the outside of the device. The thickness of the molding material in the frame-shaped portion and on the second surface of the mounting pad can be readily reduced to reduce the thickness of the device. Since the molding material does not cover the entire second surface, molding characteristics as well as heat radiation characteristics are improved.
公开/授权文献
- US4357866A Calender for a traveling web, such as a paper web 公开/授权日：1982-11-09
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