发明授权
- 专利标题: Substrate transferring apparatus
- 专利标题(中): 基板转印装置
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申请号: US263216申请日: 1994-06-17
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公开(公告)号: US5445486A公开(公告)日: 1995-08-29
- 发明人: Hirofumi Kitayama , Hiroyuki Iwai , Shinichi Wada , Tetsu Oosawa
- 申请人: Hirofumi Kitayama , Hiroyuki Iwai , Shinichi Wada , Tetsu Oosawa
- 申请人地址: JPX Kanagawa
- 专利权人: Tokyo Electron Sagami Limited
- 当前专利权人: Tokyo Electron Sagami Limited
- 当前专利权人地址: JPX Kanagawa
- 优先权: JPX4-102153 19920329
- 主分类号: B65G49/07
- IPC分类号: B65G49/07 ; H01L21/677 ; H01L21/687 ; B65G65/00
摘要:
According to the invention, there is provided a substrate transferring apparatus for transferring substrates from a substrate transport container containing a plurality of substrates to be treated to a substrate holder for holding a plurality of substrates to be treated or vice versa, the apparatus including arms for supporting substrate, a supporting member for supporting the arms, and a drive arrangement for driving the supporting member to operate. Each of the arms include a plate shaped arm main body having a connecting section for connecting the arm to the drive arrangement, supporting sections having a thickness greater than that of the arm main body for supporting corresponding peripheral areas of the substrate, and stoppers having a thickness greater than that of the supporting sections for abutting lateral sides of the substrate to rigidly hold the substrate.
公开/授权文献
- US6146911A Semiconductor wafer and method of manufacturing the same 公开/授权日:2000-11-14
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