发明授权
US5449588A Photosensitive polyimide precursor composition with photoacid generator
失效
光敏聚酰亚胺前体组合物与光致酸发生器
- 专利标题： Photosensitive polyimide precursor composition with photoacid generator
- 专利标题（中）： 光敏聚酰亚胺前体组合物与光致酸发生器
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申请号： US250573申请日： 1994-05-27
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公开(公告)号： US5449588A公开(公告)日： 1995-09-12
- 发明人: Hirotoshi Maeda , Eiji Watanabe , Kouichi Katou , Kouichi Kunimune
- 申请人： Hirotoshi Maeda , Eiji Watanabe , Kouichi Katou , Kouichi Kunimune
- 申请人地址： JPX Osaka
- 专利权人： Chisso Corporation
- 当前专利权人： Chisso Corporation
- 当前专利权人地址： JPX Osaka
- 优先权： JPX6-04383 19940215
- 主分类号： C08G73/10
- IPC分类号： C08G73/10 ; G03F7/004 ; G03F7/038 ; G03F7/075
摘要：
A photosensitive resin composition containing 0.5 to 15 parts by weight of a compound generating an acid by light irradiation in 100 parts by weight of a polyamic acid amide having an alkoxysilane having a specified structure at its terminals are provided,which composition has superior resolution properties, a small shrinkage of volume, a superior adhesion onto a substrate, and can prepare a polyimide by baking.
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