发明授权
- 专利标题: Curable composition
- 专利标题(中): 可固化组合物
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申请号: US208106申请日: 1994-03-08
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公开(公告)号: US5449734A公开(公告)日: 1995-09-12
- 发明人: Jun Kotani , Kiyoshi Andoh , Takahisa Iwahara , Kazuya Yonezawa
- 申请人: Jun Kotani , Kiyoshi Andoh , Takahisa Iwahara , Kazuya Yonezawa
- 申请人地址: JPX Osaka
- 专利权人: Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
- 当前专利权人: Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
- 当前专利权人地址: JPX Osaka
- 优先权: JPX5-075104 19930310
- 主分类号: C08G77/12
- IPC分类号: C08G77/12 ; C08G77/06 ; C08G77/18 ; C08G77/20 ; C08G77/22 ; C08G77/50 ; C08K5/5419 ; C08L83/04 ; C08L83/05 ; C08L83/06 ; C08L83/07 ; C08G77/08
摘要:
A curable composition containing (A) a compound having at least two Si--H bonds, (B) a silicon compound having at least two substituents bonded to the silicon atom thereof, wherein the substituents each have an olefin bond, (C) a neutral platinum catalyst, (D) a silicon compound having at least two alkoxy groups bonded to the silicon atom thereof, and (E) a catalyst for silanol condensation.