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公开(公告)号:US5449734A
公开(公告)日:1995-09-12
申请号:US208106
申请日:1994-03-08
申请人: Jun Kotani , Kiyoshi Andoh , Takahisa Iwahara , Kazuya Yonezawa
发明人: Jun Kotani , Kiyoshi Andoh , Takahisa Iwahara , Kazuya Yonezawa
IPC分类号: C08G77/12 , C08G77/06 , C08G77/18 , C08G77/20 , C08G77/22 , C08G77/50 , C08K5/5419 , C08L83/04 , C08L83/05 , C08L83/06 , C08L83/07 , C08G77/08
摘要: A curable composition containing (A) a compound having at least two Si--H bonds, (B) a silicon compound having at least two substituents bonded to the silicon atom thereof, wherein the substituents each have an olefin bond, (C) a neutral platinum catalyst, (D) a silicon compound having at least two alkoxy groups bonded to the silicon atom thereof, and (E) a catalyst for silanol condensation.
摘要翻译: 一种可固化组合物,其包含(A)具有至少两个Si-H键的化合物,(B)具有至少两个与其硅原子键合的取代基的硅化合物,其中所述取代基各自具有烯烃键,(C)中性 铂催化剂,(D)具有与硅原子键合的至少两个烷氧基的硅化合物,(E)硅烷醇缩合用催化剂。