发明授权
- 专利标题： Semiconductor component package
- 专利标题（中）： 半导体元件封装
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申请号： US235055申请日： 1994-04-29
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公开(公告)号： US5463250A公开(公告)日： 1995-10-31
- 发明人: Ngon B. Nguyen , Franklin B. Jones
- 申请人： Ngon B. Nguyen , Franklin B. Jones
- 申请人地址： PA Pittsburgh
- 专利权人： Westinghouse Electric Corp.
- 当前专利权人： Westinghouse Electric Corp.
- 当前专利权人地址： PA Pittsburgh
- 主分类号： H01L23/053
- IPC分类号： H01L23/053 ; H01L23/367 ; H01L23/02 ; H01L23/12
摘要：
A package for power semiconductor components permitting high thermal dissipation and current conductance and including a frame assembly bonded to a substrate on which a power semiconductor chip is mounted. The frame assembly has a wirebonding grid for connecting short, uniform length wirebonds to the surface of the chip. The grid is configured so as to have a portion overlaying and spaced from the chip a distance less than a distance required to connect a wirebond of optimal length to each anode cell of the chip. The package allows a high power semiconductor device to be used as a surface mount device or as a hockey puck.
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