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    High voltage hybrid package
    1.
    发明授权
    High voltage hybrid package 失效
    高压混合封装

    公开(公告)号：US5057648A

    公开(公告)日：1991-10-15

    申请号：US439053

    申请日：1989-11-20

    申请人： David N. Blough ,  Ngon B. Nguyen

    发明人： David N. Blough ,  Ngon B. Nguyen

    IPC分类号： H01L25/16

    CPC分类号： H01L25/165 ,  H01L2924/0002

    摘要： A package for a heat generating, high voltage hybrid circuit is disclosed which comprises a package housing having a sidewall structure formed from an electrically insulative, thermally conductive ceramic material that obviates the need for using separate insulator structures between the sidewalls of the package and the electrical feedthroughs which afford electrical access to the circuit contained within the package housing. The feedthroughs include a layer of hardenable material for sealingly mounting a terminal connector through the sidewalls of the package. In one embodiment of the invention, the hardenable material sealingly mounts the terminal connectors of the electrical feedthroughs within circular openings in the sidewall structure. In another embodiment, the terminal connectors of the electrical feedthroughs include flat sections formed from copper directly deposited in recesses located within a ceramic frame disposed between the sidewall structure and the base of the package, and the hardenable material sealingly mounts the lower edge of the wall section over the upper surface of the ceramic frame. Both embodiments provide increased voltage and current carrying capacity in a package structure which is more reliable in operation.

    摘要翻译： 公开了一种用于发热高压混合电路的封装，其包括具有由电绝缘导热陶瓷材料形成的侧壁结构的封装壳体，其消除了在封装的侧壁和电气之间使用分离的绝缘体结构的需要 馈电，其提供对包含在封装壳体内的电路的电气接入。 馈通包括用于通过封装的侧壁密封地安装端子连接器的可硬化材料层。 在本发明的一个实施例中，可硬化材料将电馈通件的端子连接器密封地安装在侧壁结构中的圆形开口内。 在另一个实施例中，电馈通的端子连接器包括由直接沉积在设置在侧壁结构和封装的基座之间的陶瓷框架内的凹槽中的铜形成的平坦部分，并且可硬化材料密封地安装在壁的下边缘 在陶瓷框架的上表面上。 两个实施例在包装结构中提供增加的电压和电流承载能力，其在操作中更可靠。

    Packaging for electronic power devices and applications using the packaging
    2.
    发明授权
    Packaging for electronic power devices and applications using the packaging 失效
    使用包装的电子电源设备和应用的包装

    公开(公告)号：US5892279A

    公开(公告)日：1999-04-06

    申请号：US570051

    申请日：1995-12-11

    申请人： Ngon B. Nguyen

    发明人： Ngon B. Nguyen

    IPC分类号： H01L23/373 ,  H01L23/473 ,  H01L23/06 ,  H01L23/10 ,  H01L23/34 ,  H01L23/52

    CPC分类号： H01L23/473 ,  H01L23/3735 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/30107

    摘要： A packaging for high-power devices such as Insulated Gate Bipolar Transistors includes a direct bonded copper substrate (DBC), such as beryllium oxide (BeO), soldered directly to a heat generating surface of the high-power device. The direct bonded copper substrate (DBC) is, in turn, soldered directly to a liquid cooled heatsink (HS). The packaging improves the thermal management of the heat generated by the high-power device, and is applicable for use in a switching circuit for a 3-phase electric traction motor (M). The assembly also provides for improved wirebonding design in order to use each high-power device to its fullest.

    摘要翻译： 用于诸如绝缘栅双极晶体管的大功率器件的封装包括直接焊接到大功率器件的发热表面的直接键合铜衬底（DBC），例如氧化铍（BeO）。 直接键合的铜基底（DBC）又直接焊接到液体冷却的散热片（HS）上。 该封装改善了大功率器件产生的热量的热管理，适用于三相电动牵引电动机（M）的开关电路。 该组件还提供改进的引线键合设计，以便最大限度地使用每个大功率器件。

    Direct cooled switching module for electric vehicle propulsion system
    5.
    发明授权
    Direct cooled switching module for electric vehicle propulsion system 失效
    电动车推进系统的直接冷却开关模块

    公开(公告)号：US5504378A

    公开(公告)日：1996-04-02

    申请号：US258027

    申请日：1994-06-10

    申请人： Frank A. Lindberg ,  Richard M. Young ,  William B. Hall ,  Frank E. Altoz ,  Ngon B. Nguyen

    发明人： Frank A. Lindberg ,  Richard M. Young ,  William B. Hall ,  Frank E. Altoz ,  Ngon B. Nguyen

    IPC分类号： H02M7/00 ,  H05K5/00 ,  H05K7/20

    CPC分类号： H05K7/20927 ,  H02M7/003 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2924/01004 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1627 ,  H01L2924/19041 ,  H01L2924/30107

    摘要： An apparatus for cooling a switching circuit for an electric vehicle, wherein the switching circuit has at least two switching elements connected in series, includes first and second heat sinks, each having two thermally-conductive planar members forming a passage therebetween for channeling cooling fluid, an inlet port in communication with the passage, and an outlet port in communication with the passage, and a substrate for mounting at least one switching element to each of the first and second heat sinks. An ac terminal connects the switching element attached to the first heat sink in series with the switching element attached to the second heat sink, and inlet and outlet manifolds, coupled to the inlet and outlet ports of the first and second heat sinks, circulate cooling fluid through the passages of the first and second heat sinks to cool the switching elements.

    摘要翻译： 一种用于冷却电动车辆的开关电路的装置，其中开关电路具有串联连接的至少两个开关元件，包括第一和第二散热器，每个具有两个导热平面构件，在其间形成用于引导冷却流体的通道， 与通道连通的入口端口和与通道连通的出口端口以及用于将至少一个开关元件安装到第一和第二散热器中的每一个的基板。 交流端子将附接到第一散热器的开关元件与附接到第二散热器的开关元件串联连接，并且连接到第一和第二散热器的入口和出口的入口和出口歧管使冷却流体 通过第一和第二散热器的通道来冷却开关元件。

    Modular solid state relay
    6.
    发明授权
    Modular solid state relay 失效
    模块化固态继电器

    公开(公告)号：US5463252A

    公开(公告)日：1995-10-31

    申请号：US130401

    申请日：1993-10-01

    申请人： Franklin B. Jones ,  Ngon B. Nguyen ,  Leroy Laurandeau

    发明人： Franklin B. Jones ,  Ngon B. Nguyen ,  Leroy Laurandeau

    IPC分类号： H01L25/18 ,  H02H3/087 ,  H01L23/16 ,  H01L39/02

    CPC分类号： H01L25/18 ,  H02H3/087 ,  H01L2924/0002

    摘要： A solid state circuit breaker utilizing fast acting solid state relays which are made up of individual switching circuit modules using silicon metal oxide semiconductor field effect transistors or silicon carbide metal oxide semiconductor field effect transistors. Depending on the power requirements, the individual modules may be arranged to provide heat dissipation while at the same time minimizing the total overall space occupied in the circuit breaker.

    摘要翻译： 一种使用快速固态继电器的固态断路器，其由使用硅金属氧化物半导体场效应晶体管或碳化硅金属氧化物半导体场效应晶体管的单独的开关电路模块构成。 根据功率要求，各个模块可以被布置成提供散热，同时最小化断路器中占用的总的总空间。

    High power self commutating semiconductor switch
    7.
    发明授权
    High power self commutating semiconductor switch 失效
    大功率自换向半导体开关

    公开(公告)号：US5283463A

    公开(公告)日：1994-02-01

    申请号：US846108

    申请日：1992-03-05

    申请人： Ngon B. Nguyen ,  Franklin B. Jones ,  Charles S. Kerfoot ,  Gene A. DiGennaro

    发明人： Ngon B. Nguyen ,  Franklin B. Jones ,  Charles S. Kerfoot ,  Gene A. DiGennaro

    IPC分类号： H01L23/36 ,  H01L23/64 ,  H01L25/16 ,  H01L23/02 ,  H01L23/12 ,  H01L23/16

    CPC分类号： H01L25/16 ,  H01L23/36 ,  H01L23/645 ,  H01L2224/48091 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/16195 ,  H01L2924/30107

    摘要： In one embodiment, the invention is a packaged high power electronic switch in the form of a semiconductor chip having metalized planar cathode and anode terminals and a gate terminal. A refractory annular ring has planar open end faces and side walls having stepped portions. A pair of thermally and electrically conductive planar substrates is bonded to the opposite end faces of the annular ring and is maintained in spaced relation thereby, forming an enclosed space. At least one conductive strap within the space is supported by the stepped portion of the internal side wall and extends to one of the substrates forming an electrical and thermal path. One of said conductive substrates receives one of the planar terminals of the chip in intimate electrical and thermal contact. The strap is electrically coupled to the other of said terminals, for forming a high current path between the substrates via the strap. Additional components, such as a commutating diode and gate protection zener diode, may be employed and provide a self protected switch assembly.

    摘要翻译： 在一个实施例中，本发明是具有金属化平面阴极和阳极端子以及栅极端子的半导体芯片形式的封装大功率电子开关。 耐火环形环具有平坦的开口端面和具有台阶部分的侧壁。 一对导热和导电的平面基板被结合到环形环的相对端面并且保持间隔关系，从而形成封闭空间。 在该空间内的至少一个导电带由内侧壁的阶梯部分支撑并且延伸到形成电和热路径的基板之一。 所述导电基板中的一个在紧密的电和热接触中接收芯片的平面端子之一。 带子电耦合到另一个所述端子，用于通过带子在基板之间形成高电流路径。 可以采用附加组件，例如整流二极管和栅极保护齐纳二极管，并提供自保护开关组件。