- 专利标题: Optical exposure method
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申请号: US69853申请日: 1993-06-01
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公开(公告)号: US5465220A公开(公告)日: 1995-11-07
- 发明人: Tamae Haruki , Kenji Nakagawa , Masao Taguchi , Hiroyuki Tanaka , Satoru Asai , Isamu Hanyu
- 申请人: Tamae Haruki , Kenji Nakagawa , Masao Taguchi , Hiroyuki Tanaka , Satoru Asai , Isamu Hanyu
- 申请人地址: JPX Kanagawa
- 专利权人: Fujitsu Limited
- 当前专利权人: Fujitsu Limited
- 当前专利权人地址: JPX Kanagawa
- 优先权: JPX4-141548 19920602; JPX4-141755 19920602; JPX4-182913 19920618; JPX4-267415 19921006; JPX5-60593 19930319
- 主分类号: G03F7/20
- IPC分类号: G03F7/20 ; G03F7/207 ; G06F9/00
摘要:
An optical exposure method in photolithography applied for precise processing when semiconductor devices are produced. A pattern on a photomask is projected and exposed on a register on a base plate with an exposure device including a deformation illumination system, a photomask and a projection lens. The deformation illumination system is composed of a light source, a diaphragm and a condenser lens, and the diaphragm is provided with a linear through-hole. The optical exposure method uses a ray of linear light for illumination or two rays of linear light for illumination that are parallel with the pattern. The two rays of linear light are symmetrical with respect to an optical axis. These rays are parallel with the pattern in a position separate from the optical axis of the exposure device when the photomask pattern is a line and space pattern.
公开/授权文献
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