发明授权
US5471096A Solder interconnection from a composition containing a mixture of
dicyanates
失效
从含有二氰化物混合物的组合物的焊接互连
- 专利标题： Solder interconnection from a composition containing a mixture of dicyanates
- 专利标题（中）： 从含有二氰化物混合物的组合物的焊接互连
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申请号： US145678申请日： 1993-11-04
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公开(公告)号： US5471096A公开(公告)日： 1995-11-28
- 发明人: Kostas I. Papathomas , Frederick R. Christie , David W. Wang
- 申请人： Kostas I. Papathomas , Frederick R. Christie , David W. Wang
- 申请人地址： NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： NY Armonk
- 主分类号： C08G18/76
- IPC分类号： C08G18/76 ; C08G73/06 ; C08L79/04 ; C09J175/00 ; C09J175/04 ; H01L21/56 ; H01L21/60 ; H01L23/29
摘要：
Compositions containing bisphenol M dicyanate, prepolymer thereof, or mixtures thereof, and 4,4'-ethylidene bisphenol dicyanate, prepolymer thereof or mixtures thereof; and filler having maximum particle size of 20 microns and being substantially free of alpha particle emissions. The compositions are useful in forming interconnection structures for forming an integrated semiconductor device to a carrier substrate.
公开/授权文献
- US4307028A Preparation of organo-tin compounds 公开/授权日：1981-12-22
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