发明授权
- 专利标题： Method for the manufacture of printed circuit boards
- 专利标题（中）： 制造印刷电路板的方法
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申请号： US296706申请日： 1994-08-26
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公开(公告)号： US5474798A公开(公告)日： 1995-12-12
- 发明人: Gary B. Larson , Donna Kologe , Cynthia Retallick , Jon Bengston
- 申请人： Gary B. Larson , Donna Kologe , Cynthia Retallick , Jon Bengston
- 申请人地址： CT Waterbury
- 专利权人： MacDermid, Incorporated
- 当前专利权人： MacDermid, Incorporated
- 当前专利权人地址： CT Waterbury
- 主分类号： H05K1/09
- IPC分类号： H05K1/09 ; H05K3/06 ; H05K3/10 ; H05K3/24 ; H05K3/28 ; H05K3/42 ; B05D1/32
摘要：
The present invention relates to a process for the manufacture of printed circuit boards. The method contemplates the use of electroless nickel as the primary medium for interconnection, for building circuitry to the desired thickness and as an etch resist. The method is particularly versatile in reducing the number of steps and variety of chemicals currently necessary to produce these circuit boards.
公开/授权文献
- US4896428A Card gage 公开/授权日：1990-01-30
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