发明授权
- 专利标题: Semiconductor device and carrier for carrying semiconductor device
- 专利标题(中): 半导体器件和承载半导体器件的载体
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申请号: US961161申请日: 1992-10-16
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公开(公告)号: US5475259A公开(公告)日: 1995-12-12
- 发明人: Junichi Kasai , Kazuto Tsuji , Norio Taniguchi , Takashi Mashiko , Masao Sakuma , Yukio Saigo , Yoshiyuki Yoneda , Masashi Takenaka
- 申请人: Junichi Kasai , Kazuto Tsuji , Norio Taniguchi , Takashi Mashiko , Masao Sakuma , Yukio Saigo , Yoshiyuki Yoneda , Masashi Takenaka
- 申请人地址: JPX Kawasaki JPX Satsuma JPX Kawasaki
- 专利权人: Fujitsu Limited,Kyushu Fujitsu Electronics Limited,Fujitsu Automation Limited
- 当前专利权人: Fujitsu Limited,Kyushu Fujitsu Electronics Limited,Fujitsu Automation Limited
- 当前专利权人地址: JPX Kawasaki JPX Satsuma JPX Kawasaki
- 优先权: JPX3-269645 19911017; JPX4-025399 19920212; JPX4-130900 19920522; JPX4-153842 19920612
- 主分类号: G01R1/04
- IPC分类号: G01R1/04 ; H01L21/56 ; H01L21/68 ; H01L23/31 ; H01L23/433 ; H01L23/495 ; H01L23/58 ; H01L23/02 ; H01L23/12 ; H01L23/48 ; H01L29/40
摘要:
A semiconductor device comprises a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads of the leads, and a package encapsulating at least the inner leads of the leads and the semiconductor chip so that the outer leads extend outwardly of the package. The package has an upper part and a lower part which have mutually different sizes such that a stepped part is formed between the upper and lower parts by the different sizes, and each of the outer leads have a wide part which is wider than other parts of the outer lead extending outwardly of the package only within the stepped part of the package.
公开/授权文献
- US6126147A Fence post apparatus 公开/授权日:2000-10-03