公开(公告)号：US5736428A

公开(公告)日：1998-04-07

申请号：US789661

申请日：1997-01-27

申请人： Junichi Kasai ,  Kazuto Tsuji ,  Norio Taniguchi ,  Takashi Mashiko ,  Masao Sakuma ,  Yukio Saigo ,  Yoshiyuki Yoneda ,  Masashi Takenaka

发明人： Junichi Kasai ,  Kazuto Tsuji ,  Norio Taniguchi ,  Takashi Mashiko ,  Masao Sakuma ,  Yukio Saigo ,  Yoshiyuki Yoneda ,  Masashi Takenaka

IPC分类号： G01R1/04 ,  H01L21/56 ,  H01L21/68 ,  H01L23/31 ,  H01L23/433 ,  H01L23/495 ,  H01L23/58 ,  H01L21/58 ,  H01L21/60 ,  H01L21/66

CPC分类号： G01R1/0433 ,  G01R1/04 ,  H01L21/565 ,  H01L21/6835 ,  H01L22/32 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49555 ,  H01L23/49572 ,  H01L2221/68313 ,  H01L2224/16245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3011

摘要： A process for manufacturing semiconductor device including a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads, and a package encapsulating at least the inner leads of the leads and the semiconductor chip so that the outer leads extend outwardly of the package. The package has an upper part and a lower part which have mutually different sizes such that a stepped part is formed between the upper and lower parts by the different sizes, and each of the outer leads have a wide part which is wider than other parts of the outer lead extending outwardly of the package only within the stepped part of the package.

摘要翻译： 一种制造半导体器件的方法，包括分别由内部引线和外部引线构成的多个引线，与内部引线电连接的半导体芯片以及至少封装引线和半导体芯片的内部引线的封装 外引线延伸到封装外面。 该包装具有上部和下部，它们具有相互不同的尺寸，使得通过不同的尺寸在上部和下部之间形成阶梯部分，并且每个外部引线具有比其他部分宽的部分 外部引线仅在封装的阶梯部分内延伸到封装的外侧。

公开(公告)号：US5666064A

公开(公告)日：1997-09-09

申请号：US441462

申请日：1995-05-15

申请人： Junichi Kasai ,  Kazuto Tsuji ,  Norio Taniguchi ,  Takashi Mashiko ,  Masao Sakuma ,  Yukio Saigo ,  Yoshiyuki Yoneda ,  Masashi Takenaka

发明人： Junichi Kasai ,  Kazuto Tsuji ,  Norio Taniguchi ,  Takashi Mashiko ,  Masao Sakuma ,  Yukio Saigo ,  Yoshiyuki Yoneda ,  Masashi Takenaka

IPC分类号： G01R1/04 ,  H01L21/56 ,  H01L21/68 ,  H01L23/31 ,  H01L23/433 ,  H01L23/495 ,  H01L23/58 ,  G01R31/28

CPC分类号： G01R1/0433 ,  G01R1/04 ,  H01L21/565 ,  H01L21/6835 ,  H01L22/32 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49555 ,  H01L23/49572 ,  H01L2221/68313 ,  H01L2224/16245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3011

摘要： A semiconductor device comprises a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads of the leads, and a package encapsulating at least the inner leads of the leads and the semiconductor chip so that the outer leads extend outwardly of the package. The package has an upper part and a lower part which have mutually different sizes such that a stepped part is formed between the upper and lower parts by the different sizes, and each of the outer leads have a wide part which is wider than other parts of the outer lead extending outwardly of the package only within the stepped part of the package.

摘要翻译： 半导体器件包括分别由内部引线和外部引线构成的多个引线，与引线的内部引线电连接的半导体芯片，以及至少封装引线和半导体芯片的内部引线的封装 外引线延伸到封装外面。 该包装具有上部和下部，它们具有相互不同的尺寸，使得通过不同的尺寸在上部和下部之间形成阶梯部分，并且每个外部引线具有比其他部分宽的部分 外部引线仅在封装的阶梯部分内延伸到封装的外侧。

公开(公告)号：US5750421A

公开(公告)日：1998-05-12

申请号：US789625

申请日：1997-01-27

申请人： Junichi Kasai ,  Kazuto Tsuji ,  Norio Taniguchi ,  Takashi Mashiko ,  Masao Sakuma ,  Yukio Saigo ,  Yoshiyuki Yoneda ,  Masashi Takenaka

发明人： Junichi Kasai ,  Kazuto Tsuji ,  Norio Taniguchi ,  Takashi Mashiko ,  Masao Sakuma ,  Yukio Saigo ,  Yoshiyuki Yoneda ,  Masashi Takenaka

IPC分类号： G01R1/04 ,  H01L21/56 ,  H01L21/68 ,  H01L23/31 ,  H01L23/433 ,  H01L23/495 ,  H01L23/58 ,  H01L21/60

CPC分类号： G01R1/0433 ,  G01R1/04 ,  H01L21/565 ,  H01L21/6835 ,  H01L22/32 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49555 ,  H01L23/49572 ,  H01L2221/68313 ,  H01L2224/16245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3011

摘要： A semiconductor device including a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads, and a package encapsulating at least the inner leads of the leads and the semiconductor chip so that the outer leads extend outwardly of the package. The package has an upper part and a lower part which have mutually different sizes such that a stepped part is formed between the upper and lower parts by the different sizes, and each of the outer leads have a wide part which is wider than other parts of the outer lead extending outwardly of the package only within the stepped part of the package.

摘要翻译： 一种半导体器件，包括分别由内部引线和外部引线构成的多个引线，与内部引线电连接的半导体芯片，以及至少封装引线和半导体芯片的内部引线的封装， 引线从封装外部延伸。 该包装具有上部和下部，它们具有相互不同的尺寸，使得通过不同的尺寸在上部和下部之间形成阶梯部分，并且每个外部引线具有比其他部分宽的部分 外部引线仅在封装的阶梯部分内延伸到封装的外侧。

公开(公告)号：US5475259A

公开(公告)日：1995-12-12

申请号：US961161

申请日：1992-10-16

申请人： Junichi Kasai ,  Kazuto Tsuji ,  Norio Taniguchi ,  Takashi Mashiko ,  Masao Sakuma ,  Yukio Saigo ,  Yoshiyuki Yoneda ,  Masashi Takenaka

发明人： Junichi Kasai ,  Kazuto Tsuji ,  Norio Taniguchi ,  Takashi Mashiko ,  Masao Sakuma ,  Yukio Saigo ,  Yoshiyuki Yoneda ,  Masashi Takenaka

IPC分类号： G01R1/04 ,  H01L21/56 ,  H01L21/68 ,  H01L23/31 ,  H01L23/433 ,  H01L23/495 ,  H01L23/58 ,  H01L23/02 ,  H01L23/12 ,  H01L23/48 ,  H01L29/40

CPC分类号： G01R1/0433 ,  G01R1/04 ,  H01L21/565 ,  H01L21/6835 ,  H01L22/32 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49555 ,  H01L23/49572 ,  H01L2221/68313 ,  H01L2224/16245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3011

摘要： A semiconductor device comprises a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads of the leads, and a package encapsulating at least the inner leads of the leads and the semiconductor chip so that the outer leads extend outwardly of the package. The package has an upper part and a lower part which have mutually different sizes such that a stepped part is formed between the upper and lower parts by the different sizes, and each of the outer leads have a wide part which is wider than other parts of the outer lead extending outwardly of the package only within the stepped part of the package.

摘要翻译： 半导体器件包括分别由内部引线和外部引线构成的多个引线，与引线的内部引线电连接的半导体芯片，以及至少封装引线和半导体芯片的内部引线的封装 外引线延伸到封装外面。 该包装具有上部和下部，它们具有相互不同的尺寸，使得通过不同的尺寸在上部和下部之间形成阶梯部分，并且每个外部引线具有比其他部分宽的部分 外部引线仅在封装的阶梯部分内延伸到封装的外侧。

公开(公告)号：US5637923A

公开(公告)日：1997-06-10

申请号：US455909

申请日：1995-05-31

申请人： Junichi Kasai ,  Kazuto Tsuji ,  Norio Taniguchi ,  Takashi Mashiko ,  Masao Sakuma

发明人： Junichi Kasai ,  Kazuto Tsuji ,  Norio Taniguchi ,  Takashi Mashiko ,  Masao Sakuma

IPC分类号： G01R1/04 ,  H01L21/56 ,  H01L21/68 ,  H01L23/31 ,  H01L23/433 ,  H01L23/495 ,  H01L23/58 ,  H01L23/04

CPC分类号： G01R1/0433 ,  G01R1/04 ,  H01L21/565 ,  H01L21/6835 ,  H01L22/32 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49555 ,  H01L23/49572 ,  H01L2221/68313 ,  H01L2224/16245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3011

摘要： A semiconductor device including a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads, and a package encapsulating at least the inner leads of the leads and the semiconductor chip so that the outer leads extend outwardly of the package. The package has an upper part and a lower part which have mutually different sizes such that a stepped part is formed between the upper and lower parts by the different sizes, and each of the outer leads have a wide part which is wider than other parts of the outer lead extending outwardly of the package only within the stepped part of the package.

摘要翻译： 一种半导体器件，包括分别由内部引线和外部引线构成的多个引线，与内部引线电连接的半导体芯片，以及至少封装引线和半导体芯片的内部引线的封装， 引线从封装外部延伸。 该包装具有上部和下部，它们具有相互不同的尺寸，使得通过不同的尺寸在上部和下部之间形成阶梯部分，并且每个外部引线具有比其他部分宽的部分 外部引线仅在封装的阶梯部分内延伸到封装的外侧。

公开(公告)号：US06213381B1

公开(公告)日：2001-04-10

申请号：US09208021

申请日：1998-12-09

申请人： Takao Funamoto ,  Gen Nagakubo ,  Takashi Mashiko ,  Fuminori Ishikawa ,  Tadashi Nishino ,  Yusutsugu Yoshimura ,  Toshiyuki Kajiwara ,  Kenichi Yasuda ,  Mitsuo Nihei ,  Yoshio Takakura ,  Hironori Shimogama

发明人： Takao Funamoto ,  Gen Nagakubo ,  Takashi Mashiko ,  Fuminori Ishikawa ,  Tadashi Nishino ,  Yusutsugu Yoshimura ,  Toshiyuki Kajiwara ,  Kenichi Yasuda ,  Mitsuo Nihei ,  Yoshio Takakura ,  Hironori Shimogama

IPC分类号： B21D2100

CPC分类号： B21B15/0085 ,  B23D15/00 ,  B23K20/04 ,  B23K2101/16

摘要： A bonding apparatus for bonding metal plates, includes an overlapping mechanism for overlapping end portions of the metal plates, at least two supports for supporting the overlapped portion of the metal plates at one side of the metal plates, and a shearing blade disposed opposite the supports so as to sandwich the overlapped portion of the metal plates therebetween, wherein a moving mechanism is provided for relatively moving at least one of the shearing blade and the supports so as to press the shearing blade into the overlapped portion of the metal plates disposed between the supports and the shearing glade. A method for bonding is characterized by bonding metal plates by using the above apparatus.

摘要翻译： 用于接合金属板的接合装置包括用于重叠金属板的端部的重叠机构，用于在金属板的一侧支撑金属板的重叠部分的至少两个支撑件和与支撑件相对设置的剪切刀片 以夹在其间的金属板的重叠部分，其中设置有用于相对移动剪切刀片和支撑件中的至少一个的移动机构，以将剪切刀片压入设置在其间的金属板的重叠部分 支持和剪切的山谷。 接合方法的特征在于通过使用上述装置将金属板接合。

公开(公告)号：US5512970A

公开(公告)日：1996-04-30

申请号：US423459

申请日：1995-04-19

申请人： Takashi Kamoda ,  Takashi Mashiko

发明人： Takashi Kamoda ,  Takashi Mashiko

IPC分类号： G03B1/22 ,  G03B17/00 ,  G03B17/42 ,  G03B1/18

CPC分类号： G03B17/425

摘要： A film loading apparatus for enabling a smooth initial film feeding operation by preventing a planet gear from being sent flying to a rewinding gear. The rewinding gear is connected to a fork gear which engages a take-up shaft of a patrone, and the feeding gear is connected to a one-tooth sprocket having a pawl tooth which engages a perforation of a film at the time of initial film feeding. A sun gear and the planet gear are connected to the pinion of the motor for taking up a film, and the planet gear moves between the position at which the planet gear meshes with the feeding gear and the position at which the planet gear meshes with the rewinding gear. A stopper member is provided at the position at which the stopper member checks the movement of the planet gear when the planet gear is disengaged from the feeding gear and sent flying reward the rewinding gear at the time of initial film feeding and at which the stopper member engages the planet gear when the planet gear is reversely rotated and moved toward the rewinding gear. This structure prevents the planet gear from being sent flying and meshing with the planet gear at the time of initial film feeding.

摘要翻译： 一种胶片装载装置，用于通过防止行星齿轮传送到重绕齿轮来实现平滑的初始胶片输送操作。 重绕齿轮连接到与传感器接合的叉齿轮，并且进给齿轮连接到具有棘爪齿的单齿链轮，其在初始胶片进给时接合胶片的穿孔 。 太阳齿轮和行星齿轮连接到电动机的小齿轮上，用于卷起胶片，行星齿轮在行星齿轮与进给齿轮啮合的位置和行星齿轮啮合的位置之间移动 倒带齿轮 止动构件设置在行星齿轮从进给齿轮脱离时检测行星齿轮的移动的位置，并且在初始胶片送出时发送飞行奖励重绕齿轮，并且止动构件 当行星齿轮反向旋转并朝向倒带齿轮移动时，与行星齿轮啮合。 这种结构防止行星齿轮在初始胶片送入时飞行并与行星齿轮啮合。

公开(公告)号：US06955287B2

公开(公告)日：2005-10-18

申请号：US09735548

申请日：2000-12-14

申请人： Kenji Horii ,  Yasutsugu Yoshimura ,  Tadashi Nishino ,  Takashi Kamoshita ,  Takayoshi Tomino ,  Fuminori Ishikawa ,  Takao Funamoto ,  Takashi Mashiko ,  Kenjiro Narita ,  Jong-Keun Kim ,  Ki-Chol Kim ,  Jong-Sub Lee ,  Hwang-Kyu Hwang ,  Jung-Sik Lee ,  Jin-Hee Kim

发明人： Kenji Horii ,  Yasutsugu Yoshimura ,  Tadashi Nishino ,  Takashi Kamoshita ,  Takayoshi Tomino ,  Fuminori Ishikawa ,  Takao Funamoto ,  Takashi Mashiko ,  Kenjiro Narita ,  Jong-Keun Kim ,  Ki-Chol Kim ,  Jong-Sub Lee ,  Hwang-Kyu Hwang ,  Jung-Sik Lee ,  Jin-Hee Kim

IPC分类号： B23D15/02 ,  B21B1/26 ,  B21B15/00 ,  B23D35/00 ,  B23K20/02 ,  B23K20/04 ,  B21D21/00

CPC分类号： B23D35/001 ,  B21B15/0085 ,  B21B2015/0014 ,  B23K20/023 ,  B23K2101/18

摘要： An upper shearing blade equipped with a protrusion of a triangle-columnar shape and a lower shearing blade equipped with a protrusion of the same shape are applied onto the overlapped portion of metal plates to be bonded, and then pressed into the metal plates in an oblique direction inclined with respect to the thickness direction by a stroke in such a range that the metal plates are not completely cut off. The operating loci of the upper, shearing blade and the lower shearing blade are overlapped each other so that one falls inside the other, and the sheared surfaces of the metal plates are formed into a bonded portion by plastic flow deformation. Therein, since a compressive force is applied onto the portions to be bonded, the portion being defined by the amount of overlap, and the portions are compressed to form a compressed portion after completion of bonding, the bonding strength enhances. Besides, since the protrusions on the shearing blades generate a pressing force pressing the sheared surfaces onto each other, by an effect of their inclined surfaces, a compression force applied onto the bonded portion further increases.

摘要翻译： 将配备有三角柱状突起的上剪切刀片和配备有相同形状的突起的下剪切刀片施加到要接合的金属板的重叠部分上，然后以倾斜的方式压入金属板 相对于厚度方向倾斜的方向为金属板未完全切断的范围内的行程。 上剪切刀片和下剪切刀片的操作轨迹彼此重叠，使得其彼此落下，并且金属板的剪切表面通过塑性流动变形形成接合部分。 其中，由于在要接合的部分上施加压缩力，该部分由重叠量限定，并且在结合完成之后压缩该部分以形成压缩部分，因此提高了接合强度。 此外，由于剪切刀片上的突起产生按压剪切面彼此的挤压力，所以通过它们的倾斜表面的作用，施加在接合部分上的压缩力进一步增加。

公开(公告)号：US5884832A

公开(公告)日：1999-03-23

申请号：US736208

申请日：1996-10-25

申请人： Takao Funamoto ,  Gen Nagakubo ,  Takashi Mashiko ,  Fuminori Ishikawa ,  Tadashi Nishino ,  Yusutsugu Yoshimura ,  Toshiyuki Kajiwara ,  Kenichi Yasuda ,  Mitsuo Nihei ,  Yoshio Takakura ,  Hironori Shimogama

发明人： Takao Funamoto ,  Gen Nagakubo ,  Takashi Mashiko ,  Fuminori Ishikawa ,  Tadashi Nishino ,  Yusutsugu Yoshimura ,  Toshiyuki Kajiwara ,  Kenichi Yasuda ,  Mitsuo Nihei ,  Yoshio Takakura ,  Hironori Shimogama

IPC分类号： B21B15/00 ,  B23K20/02

CPC分类号： B21B15/0085 ,  B23K20/023 ,  B23K2201/16

摘要： A bonding apparatus for bonding metal plates, includes an overlapping mechanism for overlapping end portions of the metal plates, at least two supports for supporting the overlapped portion of the metal plates at one side of the metal plates, and a shearing blade disposed opposite the supports so as to sandwich the overlapped portion of the metal plates therebetween, wherein a mechanism is provided for moving relatively moving at least one of the shearing blade and the supports so as to press the shearing blade into the overlapped portion of the metal plates disposed between the supports and the shearing blade. A method for bonding is characterized by bonding metal plates by using the above apparatus.

摘要翻译： 用于接合金属板的接合装置包括用于重叠金属板的端部的重叠机构，用于在金属板的一侧支撑金属板的重叠部分的至少两个支撑件和与支撑件相对设置的剪切刀片 以夹在其间的金属板的重叠部分，其中设置有用于移动相对移动的剪切刀片和支撑件中的至少一个的机构，以将剪切刀片压入设置在该金属板之间的金属板的重叠部分中 支撑和剪切刀片。 接合方法的特征在于通过使用上述装置将金属板接合。

公开(公告)号：US5682565A

公开(公告)日：1997-10-28

申请号：US400818

申请日：1995-03-08

申请人： Takashi Kamoda ,  Takashi Mashiko

发明人： Takashi Kamoda ,  Takashi Mashiko

IPC分类号： G03B17/00 ,  G03B17/42 ,  G03B1/00

CPC分类号： G03B17/425

摘要： A feeding tooth of a one-tooth sprocket retracts from a film so that the film can be prevented from being damaged by the feeding tooth of the one-tooth sprocket when the film is rewound. When a motor rotates in a film winding direction, a rewinding fork becomes free and a spool and the one-tooth sprocket rotates in a winding direction. As a result, the feeding tooth of the one-tooth sprocket engages with a perforation of the film to feed the end of the film up to the spool. On the other hand, when the motor rotates in the film rewinding direction, the one-tooth sprocket becomes free and the spool and the rewinding fork rotate in the rewinding direction. As a result, the film is wound around a rotation axis of a patrone. In this case, the feeding tooth of the one-tooth sprocket retracts from the film.

摘要翻译： 单齿链轮的进给齿从薄膜缩回，以便当薄膜重绕时可以防止薄膜被单齿链轮的进给齿损坏。 当电动机沿膜卷绕方向旋转时，倒卷叉自由，并且卷轴和单齿链轮沿卷绕方向旋转。 结果，单齿链轮的进给齿与薄膜的穿孔接合，以将薄膜的末端送至卷筒。 另一方面，当电动机沿胶卷重绕方向旋转时，单齿链轮变得松脱，并且卷轴和倒带叉在重绕方向上旋转。 结果，薄膜卷绕在托盘的旋转轴上。 在这种情况下，单齿轮的进给齿从薄膜缩回。