Invention Grant
- Patent Title: Selective removal of a single solder ball from an array of solder balls
- Patent Title (中): 从焊球阵列中选择性地去除单个焊球
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Application No.: US288521Application Date: 1994-08-10
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Publication No.: US5478009APublication Date: 1995-12-26
- Inventor: Mario J. Interrante , Laertis Economikos
- Applicant: Mario J. Interrante , Laertis Economikos
- Applicant Address: NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: NY Armonk
- Main IPC: B26F3/00
- IPC: B26F3/00 ; B23K1/018 ; B23K1/06 ; B23K3/02 ; H01L21/304 ; H01L21/60 ; H05K3/34 ; H01L21/00
Abstract:
A solder ball removal tool uses ultrasonic vibrations to remove specific solder balls from high density chips, substrate solder ball terminal connections, card or board solder ball connections, or other solder ball array for the purpose of customizing the electrical functionality of a module. The tool also allows for the removal of damaged or defective solder balls for the purpose of replacement with defect free solder balls.
Public/Granted literature
- US4918805A Welding method for cylinder head repair Public/Granted day:1990-04-24
Information query
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