发明授权
- 专利标题: Light emitting device
- 专利标题(中): 发光装置
-
申请号: US261150申请日: 1994-06-14
-
公开(公告)号: US5481558A公开(公告)日: 1996-01-02
- 发明人: Masao Ikeda , Toyoharu Ohata
- 申请人: Masao Ikeda , Toyoharu Ohata
- 申请人地址: JPX Tokyo
- 专利权人: Sony Corporation
- 当前专利权人: Sony Corporation
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX5-143910 19930615
- 主分类号: H01S5/00
- IPC分类号: H01S5/00 ; H01S5/327 ; H01S3/19
摘要:
According to the present invention, a p-type ZnSe or p-type ZnSSe buffer layer is formed on a p-type GaAs substrate through at least single layer made of AlGaInP-based material and a II/VI-compound laser structure is formed on the p-type ZnSe or p-type ZnSSe buffer layer. Further, an AlGaAs-based buffer layer is provided between the substrate and the AlGaInP-based buffer layer. Further, the AlGaAs-based buffer layer has a composition expressed as Al.sub.0.5 Ga.sub.0.4 As and the AlGaInP-based buffer layer has a composition expressed as Al.sub.0.5 In.sub.0.5 P. Furthermore, a composition ratio x of Al in a buffer layer expressed as Al.sub.x Ga.sub.1-x As is modulated from 0 to 0.6 and a composition ratio y of Al in a buffer layer expressed as (Al.sub.y Ga.sub.1-y).sub.0.5 In.sub.0.5 P is modulated from 0 to 1. According to the present invention, an operation voltage of the II/VI-compound semiconductor laser can be reduced and the green or blue color semiconductor laser of low operation voltage can be obtained. This semiconductor laser can continuously be operated at room temperature and also operated with a long life span.
公开/授权文献
- US4848571A Protective housing for transporting circular saw blades 公开/授权日:1989-07-18
信息查询