A computer controlled system for high speed surface mount adhesive placement in circuit board production includes a dot generator supported for motion along the X, Y and Z axes. The dot generator ejects a jet of viscous adhesive that breaks away from the nozzle of the dot generator as a result of its own forward momentum. The system includes an automatic circuit board conveyor with adjustable width and pneumatically operated lift and lock mechanisms. The system runs through a self-diagnostic set-up procedure and dot calibration routine. Dot size and location are monitored through a video camera and vision circuit. A computer interfaces with the vision circuit and with motion, dot generator and conveyor controllers so that the system can operate in a high volume production assembly line. Application programs are executed by the system computer typically utilizing CAD data from a disk or a computer integrated manufacturing (CIM) controller. The system automatically assigns dot sizes to specific components based on user specifications or a component library. Dot placement paths are optimized by aligning the in-line points.