A solder-film forming apparatus for automatically forming a solder-film on a conductive pad of a printed-wiring board. The solder-film forming apparatus includes a mechanism for receiving a solder ball, a suction head provided on a distal end thereof with a holding surface for holding the solder ball and a suction port opening to the holding surface, a suction mechanism for generating a negative pressure in the suction port of the suction head, and a mechanism for moving the suction head. The solder-film forming apparatus further includes a controller having printed-wiring board information in which data including a positional information of the pad on the printed-wiring board is preset and controlling a movement of the suction head by the head moving mechanism and an operation of the suction mechanism in accordance with the printed-wiring board information. A laser beam is irradiated from a laser unit to the solder ball placed on the conductive pad of the printed-wiring board and as a result, the solder ball is fused to form a solder-film. The positional relation between the laser unit and the pad is detected by a camera and corrected.