发明授权
- 专利标题： Tape carrier semiconductor device
- 专利标题（中）： 磁带载体半导体器件
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申请号： US212786申请日： 1994-03-15
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公开(公告)号： US5506444A公开(公告)日： 1996-04-09
- 发明人: Yasunori Chikawa , Yoshiaki Honda , Katsunobu Mori , Naoyuki Tajima , Takaaki Tsuda , Takamichi Maeda , Mitsuaki Osono
- 申请人： Yasunori Chikawa , Yoshiaki Honda , Katsunobu Mori , Naoyuki Tajima , Takaaki Tsuda , Takamichi Maeda , Mitsuaki Osono
- 申请人地址： JPX Osaka
- 专利权人： Sharp Kabushiki Kaisha
- 当前专利权人： Sharp Kabushiki Kaisha
- 当前专利权人地址： JPX Osaka
- 优先权： JPX2-401252 19901211; JPX5-057099 19930317
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; H01L23/29 ; H01L23/31 ; H01L23/495 ; H01L23/28
摘要：
In a semiconductor device of a tape carrier package type, the gap width between inner leads connected with a first edge side of a semiconductor chip set within a device mounting hole provided in the tape carrier is larger than the gap width between leads connected with a second edge side opposite to the first edge side of the semiconductor chip, and the gap length of device mounting hole between the first edge of the semiconductor chip and the first edge of the device mounting hole corresponding to the first edge of the semiconductor chip is smaller than the gap length between the second edge of the semiconductor chip and the second edge of the device mounting hole corresponding to the second edge of the semiconductor chip. Such structure enables an encapsulation resin to fill uniformly the device mounting hole, and the encapsulation resin after encapsulation has a shape of a designed dimension.
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