公开(公告)号：US5506444A

公开(公告)日：1996-04-09

申请号：US212786

申请日：1994-03-15

申请人： Yasunori Chikawa ,  Yoshiaki Honda ,  Katsunobu Mori ,  Naoyuki Tajima ,  Takaaki Tsuda ,  Takamichi Maeda ,  Mitsuaki Osono

发明人： Yasunori Chikawa ,  Yoshiaki Honda ,  Katsunobu Mori ,  Naoyuki Tajima ,  Takaaki Tsuda ,  Takamichi Maeda ,  Mitsuaki Osono

IPC分类号： H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L23/495 ,  H01L23/28

CPC分类号： H01L21/56 ,  H01L23/293 ,  H01L23/3121 ,  H01L2924/0002

摘要： In a semiconductor device of a tape carrier package type, the gap width between inner leads connected with a first edge side of a semiconductor chip set within a device mounting hole provided in the tape carrier is larger than the gap width between leads connected with a second edge side opposite to the first edge side of the semiconductor chip, and the gap length of device mounting hole between the first edge of the semiconductor chip and the first edge of the device mounting hole corresponding to the first edge of the semiconductor chip is smaller than the gap length between the second edge of the semiconductor chip and the second edge of the device mounting hole corresponding to the second edge of the semiconductor chip. Such structure enables an encapsulation resin to fill uniformly the device mounting hole, and the encapsulation resin after encapsulation has a shape of a designed dimension.

摘要翻译： 在载带封装型的半导体器件中，与设置在带载体中的器件安装孔内的半导体芯片的与第一边缘侧连接的内部引线之间的间隙宽度大于与第二引线连接的引线之间的间隙宽度 边缘侧与半导体芯片的第一边缘侧相对，并且半导体芯片的第一边缘与对应于半导体芯片的第一边缘的器件安装孔的第一边缘之间的器件安装孔的间隙长度小于 半导体芯片的第二边缘与器件安装孔的与半导体芯片的第二边缘对应的第二边缘之间的间隙长度。 这样的结构能够使封装树脂均匀地填充装置安装孔，并且封装后的封装树脂具有设计尺寸的形状。

公开(公告)号：US5281848A

公开(公告)日：1994-01-25

申请号：US796431

申请日：1991-11-22

申请人： Yasunori Chikawa ,  Yoshiaki Honda ,  Katsunobu Mori ,  Naoyuki Tajima ,  Takaaki Tsuda ,  Takamichi Maeda

发明人： Yasunori Chikawa ,  Yoshiaki Honda ,  Katsunobu Mori ,  Naoyuki Tajima ,  Takaaki Tsuda ,  Takamichi Maeda

IPC分类号： H01L21/60 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L23/28

CPC分类号： H01L21/56 ,  H01L23/293 ,  H01L23/3121 ,  H01L2924/0002 ,  Y10T29/49121

摘要： A tape carrier semiconductor device has a resin sealed area not much larger than the size of the semiconductor chip, e.g. substantially not exceeding 2 mm to the outside. A device hole is not larger than an area formed by extending the outer periphery of the semiconductor chip to the outside by 0.3 mm and an epoxy resin of 500-1200 ps in viscosity is used for sealing the chip.

摘要翻译： 带载半导体器件具有不比半导体芯片的尺寸大得多的树脂密封区域，例如， 基本上不超过2mm。 器件孔不大于通过将半导体芯片的外周向外延伸0.3mm而形成的区域，并且使用粘度为500-1200ps的环氧树脂来密封芯片。

公开(公告)号：US5336650A

公开(公告)日：1994-08-09

申请号：US112315

申请日：1993-08-27

申请人： Yasunori Chikawa ,  Yoshiaki Honda ,  Katsunobu Mori ,  Naoyuki Tajima ,  Takaaki Tsuda ,  Takamichi Maeda

发明人： Yasunori Chikawa ,  Yoshiaki Honda ,  Katsunobu Mori ,  Naoyuki Tajima ,  Takaaki Tsuda ,  Takamichi Maeda

IPC分类号： H01L21/60 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31

CPC分类号： H01L21/56 ,  H01L23/293 ,  H01L23/3121 ,  H01L2924/0002 ,  Y10T29/49121

摘要： A tape carrier semiconductor device has a resin sealed area not so larger than the size of the semiconductor chip, e.g. substantially not exceeding 2 mm to the outside. A device hole is not larger than an area formed by extending the outer periphery of the semiconductor chip to the outside by 0.3 mm and an epoxy resin of 500-1200 ps in viscosity is used for sealing the chip.

摘要翻译： 带载半导体器件具有树脂密封区域不大于半导体芯片的尺寸，例如， 基本上不超过2mm。 器件孔不大于通过将半导体芯片的外周向外延伸0.3mm而形成的区域，并且使用粘度为500-1200ps的环氧树脂来密封芯片。

公开(公告)号：US5310699A

公开(公告)日：1994-05-10

申请号：US905683

申请日：1992-06-29

申请人： Yasunori Chikawa ,  Shigeyuki Sasaki ,  Katsunobu Mori ,  Takamichi Maeda ,  Masao Hayakawa

发明人： Yasunori Chikawa ,  Shigeyuki Sasaki ,  Katsunobu Mori ,  Takamichi Maeda ,  Masao Hayakawa

IPC分类号： H01L21/60 ,  H01L23/485 ,  H01L23/532 ,  H01L21/28 ,  H01L21/447 ,  H01L21/92

CPC分类号： H01L24/11 ,  H01L23/53242 ,  H01L23/53252 ,  H01L24/13 ,  H01L2224/1147 ,  H01L2224/13007 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04941

摘要： A method of manufacturing a semiconductor device with a bump-electrode of gold crystal is disclosed. The method includes providing a semiconductor substrate, an insulative layer, an electrode section, passivation layer on the edge portion of the electrode section, a multi-layer film, and a bump electrode of gold crystal. The method further includes heat treatment of the bump electrode to form an anticorrosive layer between the electrode section and the lower layer of the multi-layer film. Removing the unnecessary multi-layer film, the anticorrosive layer is used as a mask for etching to simplify the process of manufacturing the semiconductor device.

摘要翻译： 公开了一种制造具有金晶体凸块电极的半导体器件的方法。 该方法包括在电极部分的边缘部分上提供半导体衬底，绝缘层，电极部分，钝化层，多层膜和金晶体的凸块电极。 该方法还包括对凸块电极进行热处理，以在多层膜的电极部分和下层之间形成防腐蚀层。 为了简化半导体器件的制造工序，除去不需要的多层膜，将防腐蚀层用作蚀刻掩模。

公开(公告)号：US5153705A

公开(公告)日：1992-10-06

申请号：US665154

申请日：1991-03-06

申请人： Kazuhiko Fukuta ,  Naoyuki Tajima ,  Yasunori Chikawa ,  Takaski Tsuda ,  Takamichi Maeda

发明人： Kazuhiko Fukuta ,  Naoyuki Tajima ,  Yasunori Chikawa ,  Takaski Tsuda ,  Takamichi Maeda

IPC分类号： H01L21/60 ,  G02F1/13 ,  H01L23/498 ,  H05K1/00

CPC分类号： H05K1/028 ,  H01L23/4985 ,  H01L24/50 ,  G02F1/13452 ,  H01L2924/07811 ,  H01L2924/14 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/10136 ,  H05K2201/10681

摘要： A TAB package for packaging a semiconductor chip includes a flexible base plate having a first surface and a second surface opposite to the first surface, an input and output leads being formed on the second surface of the flexible base plate and capable of being connected to the semiconductor chip, and a plurality of slits being formed on the first surface of the flexible base plate. Accordingly, the TAB package is allowed to be easily bent and kept in the bending state. The slits are formed in a manner to correspond to the intervals between the adjacent input and output leads so that the input and output leads can be reliably supported by the flexible base plate.

公开(公告)号：US4949155A

公开(公告)日：1990-08-14

申请号：US219218

申请日：1988-07-14

申请人： Naoyuki Tajima ,  Takaaki Tsuda ,  Yasunori Chikawa

发明人： Naoyuki Tajima ,  Takaaki Tsuda ,  Yasunori Chikawa

IPC分类号： H01L23/495 ,  H05K1/02

CPC分类号： H01L23/49572 ,  H01L2924/0002 ,  H05K1/0254

摘要： A tape carrier for semiconductor chips including an insulating tape; a plurality of first conductor patterns longitudinally formed on the tape and spaced from each other each of the first conductor patterns having first leads connected with substrate electrodes of a semiconductor chip and second lead connected with the other electrodes of the chip; a second conductor shaped like a stripe and disposed near each of the first conductor patterns on the tape; and a third conductor pattern formed on the tape and having conductors electrically connecting the first leads with the second conductor pattern.

公开(公告)号：US5402255A

公开(公告)日：1995-03-28

申请号：US19907

申请日：1993-02-19

申请人： Hiroyuki Nakanishi ,  Yasunori Chikawa ,  Naoyuki Tajima ,  Hiroshi Nishioka

发明人： Hiroyuki Nakanishi ,  Yasunori Chikawa ,  Naoyuki Tajima ,  Hiroshi Nishioka

IPC分类号： G02F1/13 ,  H01L23/498 ,  H05K1/14 ,  H05K3/36 ,  G02F1/1343

CPC分类号： G02F1/13452 ,  H01L23/4985 ,  H01L2224/49175 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K1/14 ,  H05K3/361

摘要： A liquid crystal panel module includes a liquid crystal panel and a plurality of tape carrier packages arranged along a side of the liquid crystal panel. A semiconductor element is attached to the tape carrier packages for operating the liquid crystal panel. Further, outer leads are disposed in the tape carrier packages on both sides of the semiconductor element and connected to each other between adjacent tape carrier packages. Finally, wires are disposed in the semiconductor element to electrically connect the outer leads, disposed on both sides of the semiconductor element, to each other.

摘要翻译： 液晶面板模块包括液晶面板和沿着液晶面板一侧布置的多个带状载体封装。 将半导体元件附接到用于操作液晶面板的带载体封装。 此外，外部引线设置在半导体元件两侧的带状载体封装中，并在相邻的载带封装之间相互连接。 最后，将导线设置在半导体元件中，将设置在半导体元件两侧的外引线彼此电连接。

公开(公告)号：US4247590A

公开(公告)日：1981-01-27

申请号：US858636

申请日：1977-12-08

申请人： Masao Hayakawa ,  Takamichi Maeda ,  Teruo Horii ,  Masao Kumura ,  Yasunori Chikawa

发明人： Masao Hayakawa ,  Takamichi Maeda ,  Teruo Horii ,  Masao Kumura ,  Yasunori Chikawa

IPC分类号： H01L21/683 ,  H01L21/60 ,  H05K1/03 ,  B32B3/00 ,  B32B3/26

CPC分类号： H01L24/83 ,  H01L24/29 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2924/01014 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/09701 ,  H05K1/0306 ,  Y10T428/24926 ,  Y10T428/249994

摘要： A semiconductor wafer is supported by a supporting plate via adhesive in some steps of fabricating a semiconductor device. The supporting plate is a porous ceramic plate impregnated with or painted with resin such as epoxy resin, silicone resin and polyimide varnish. The porous ceramic supporting plate has a low thermal conductivity to ensure stable bonding operation.

摘要翻译： 半导体晶片在制造半导体器件的一些步骤中通过粘合剂由支撑板支撑。 支撑板是浸渍或用树脂涂覆的多孔陶瓷板，例如环氧树脂，硅树脂和聚酰亚胺清漆。 多孔陶瓷支撑板具有低导热性，以确保稳定的接合操作。

公开(公告)号：US06407796B2

公开(公告)日：2002-06-18

申请号：US09873393

申请日：2001-06-05

申请人： Naoyuki Tajima ,  Yasunori Chikawa ,  Shunichi Murahashi ,  Seijirou Gyouten

发明人： Naoyuki Tajima ,  Yasunori Chikawa ,  Shunichi Murahashi ,  Seijirou Gyouten

IPC分类号： G02F11345

CPC分类号： H01L23/5387 ,  H01L2224/73204 ,  H01L2924/09701 ,  H05K1/14 ,  H05K3/361

摘要： A tape carrier package is provided, which includes: a line provided on one surface of a tape substrate; and a semiconductor chip mounted on an other surface of the tape substrate, the semiconductor chip having an electrode which is electrically connected to the line. The line extends from one end to an opposite end of the tape substrate and includes a connection where an intermediate line portion provided in a middle between the ends is electrically connected to the electrode.

摘要翻译： 提供一种胶带载体包装，其包括：设置在带基材的一个表面上的线; 以及安装在所述带基板的另一表面上的半导体芯片，所述半导体芯片具有电连接到所述线的电极。 该线从带基材的一端延伸到另一端，并且包括其中设置在端部之间的中间的中间线部分与电极电连接的连接。

公开(公告)号：US20110108979A1

公开(公告)日：2011-05-12

申请号：US12737431

申请日：2009-07-07

申请人： Tomokatsu Nakagawa ,  Yasunori Chikawa ,  Akiteru Rai ,  Tatsuya Katoh ,  Takuya Sugiyama

发明人： Tomokatsu Nakagawa ,  Yasunori Chikawa ,  Akiteru Rai ,  Tatsuya Katoh ,  Takuya Sugiyama

IPC分类号： H01L23/34

CPC分类号： H01L23/4985 ,  G02F1/13452 ,  H01L23/367 ,  H01L23/3735 ,  H01L24/81 ,  H01L2224/73204 ,  H01L2224/75252 ,  H01L2224/81203 ,  H01L2224/83862 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/12044 ,  H01L2924/3511

摘要： In a COF of an embodiment of the present invention, the smaller distance to edges of a heat-releasing member an area of the heat-releasing member has, the larger openings the area has. Accordingly, a volume per area (an area per length) of the heat-releasing member decreases toward the edges. The arrangement improves flexibility of the COF. This prevents a stress caused by bending the COF from concentrating at the edges. This makes it possible to prevent a line on an insulating film from being broken. Also, it becomes possible to prevent an anisotropic conductive resin from coming off which is used to bond the COF with a display panel in providing the COF in a display apparatus.

摘要翻译： 在本发明的实施例的COF中，散热构件的散热构件的边缘的距离越小，散热构件的区域具有该区域越大的开口。 因此，散热构件的面积（每个长度的面积）的面积朝向边缘减小。 该安排提高了COF的灵活性。 这防止了由于COF弯曲而引起的应力集中在边缘。 这使得可以防止绝缘膜上的线被破坏。 此外，可以防止在显示装置中提供COF时用于将COF与显示面板结合的各向异性导电树脂脱落。