公开(公告)号：US5506444A

公开(公告)日：1996-04-09

申请号：US212786

申请日：1994-03-15

申请人： Yasunori Chikawa ,  Yoshiaki Honda ,  Katsunobu Mori ,  Naoyuki Tajima ,  Takaaki Tsuda ,  Takamichi Maeda ,  Mitsuaki Osono

发明人： Yasunori Chikawa ,  Yoshiaki Honda ,  Katsunobu Mori ,  Naoyuki Tajima ,  Takaaki Tsuda ,  Takamichi Maeda ,  Mitsuaki Osono

IPC分类号： H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L23/495 ,  H01L23/28

CPC分类号： H01L21/56 ,  H01L23/293 ,  H01L23/3121 ,  H01L2924/0002

摘要： In a semiconductor device of a tape carrier package type, the gap width between inner leads connected with a first edge side of a semiconductor chip set within a device mounting hole provided in the tape carrier is larger than the gap width between leads connected with a second edge side opposite to the first edge side of the semiconductor chip, and the gap length of device mounting hole between the first edge of the semiconductor chip and the first edge of the device mounting hole corresponding to the first edge of the semiconductor chip is smaller than the gap length between the second edge of the semiconductor chip and the second edge of the device mounting hole corresponding to the second edge of the semiconductor chip. Such structure enables an encapsulation resin to fill uniformly the device mounting hole, and the encapsulation resin after encapsulation has a shape of a designed dimension.

摘要翻译： 在载带封装型的半导体器件中，与设置在带载体中的器件安装孔内的半导体芯片的与第一边缘侧连接的内部引线之间的间隙宽度大于与第二引线连接的引线之间的间隙宽度 边缘侧与半导体芯片的第一边缘侧相对，并且半导体芯片的第一边缘与对应于半导体芯片的第一边缘的器件安装孔的第一边缘之间的器件安装孔的间隙长度小于 半导体芯片的第二边缘与器件安装孔的与半导体芯片的第二边缘对应的第二边缘之间的间隙长度。 这样的结构能够使封装树脂均匀地填充装置安装孔，并且封装后的封装树脂具有设计尺寸的形状。

公开(公告)号：US5281848A

公开(公告)日：1994-01-25

申请号：US796431

申请日：1991-11-22

申请人： Yasunori Chikawa ,  Yoshiaki Honda ,  Katsunobu Mori ,  Naoyuki Tajima ,  Takaaki Tsuda ,  Takamichi Maeda

发明人： Yasunori Chikawa ,  Yoshiaki Honda ,  Katsunobu Mori ,  Naoyuki Tajima ,  Takaaki Tsuda ,  Takamichi Maeda

IPC分类号： H01L21/60 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L23/28

CPC分类号： H01L21/56 ,  H01L23/293 ,  H01L23/3121 ,  H01L2924/0002 ,  Y10T29/49121

摘要： A tape carrier semiconductor device has a resin sealed area not much larger than the size of the semiconductor chip, e.g. substantially not exceeding 2 mm to the outside. A device hole is not larger than an area formed by extending the outer periphery of the semiconductor chip to the outside by 0.3 mm and an epoxy resin of 500-1200 ps in viscosity is used for sealing the chip.

摘要翻译： 带载半导体器件具有不比半导体芯片的尺寸大得多的树脂密封区域，例如， 基本上不超过2mm。 器件孔不大于通过将半导体芯片的外周向外延伸0.3mm而形成的区域，并且使用粘度为500-1200ps的环氧树脂来密封芯片。

公开(公告)号：US5336650A

公开(公告)日：1994-08-09

申请号：US112315

申请日：1993-08-27

申请人： Yasunori Chikawa ,  Yoshiaki Honda ,  Katsunobu Mori ,  Naoyuki Tajima ,  Takaaki Tsuda ,  Takamichi Maeda

发明人： Yasunori Chikawa ,  Yoshiaki Honda ,  Katsunobu Mori ,  Naoyuki Tajima ,  Takaaki Tsuda ,  Takamichi Maeda

IPC分类号： H01L21/60 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31

CPC分类号： H01L21/56 ,  H01L23/293 ,  H01L23/3121 ,  H01L2924/0002 ,  Y10T29/49121

摘要： A tape carrier semiconductor device has a resin sealed area not so larger than the size of the semiconductor chip, e.g. substantially not exceeding 2 mm to the outside. A device hole is not larger than an area formed by extending the outer periphery of the semiconductor chip to the outside by 0.3 mm and an epoxy resin of 500-1200 ps in viscosity is used for sealing the chip.

摘要翻译： 带载半导体器件具有树脂密封区域不大于半导体芯片的尺寸，例如， 基本上不超过2mm。 器件孔不大于通过将半导体芯片的外周向外延伸0.3mm而形成的区域，并且使用粘度为500-1200ps的环氧树脂来密封芯片。

公开(公告)号：US5614760A

公开(公告)日：1997-03-25

申请号：US386051

申请日：1995-02-07

申请人： Mitsuaki Osono ,  Naoyuki Tajima ,  Katsunobu Mori

发明人： Mitsuaki Osono ,  Naoyuki Tajima ,  Katsunobu Mori

IPC分类号： H01L21/60 ,  H01L21/56 ,  H01L23/28 ,  H01L23/495 ,  H01L23/34 ,  H01L23/48

CPC分类号： H01L24/50 ,  H01L23/49572 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01033 ,  H01L2924/01082

摘要： In a TCP (tape carrier package) semiconductor device having opposing, inner lead arrays bonded to a semiconductor device, a projection or projections are provided on each of the inner leads disposed at intervals of a greater distance on one side of the semiconductor, within a range for allowing the resin to flow out.

摘要翻译： 在具有接合到半导体器件的相对的内引线阵列的TCP（带载封装）半导体器件中，在半导体的一侧上以更大距离的间隔设置的每个内引线上设置有突起或突起， 允许树脂流出的范围。

公开(公告)号：US5153705A

公开(公告)日：1992-10-06

申请号：US665154

申请日：1991-03-06

申请人： Kazuhiko Fukuta ,  Naoyuki Tajima ,  Yasunori Chikawa ,  Takaski Tsuda ,  Takamichi Maeda

发明人： Kazuhiko Fukuta ,  Naoyuki Tajima ,  Yasunori Chikawa ,  Takaski Tsuda ,  Takamichi Maeda

IPC分类号： H01L21/60 ,  G02F1/13 ,  H01L23/498 ,  H05K1/00

CPC分类号： H05K1/028 ,  H01L23/4985 ,  H01L24/50 ,  G02F1/13452 ,  H01L2924/07811 ,  H01L2924/14 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/10136 ,  H05K2201/10681

摘要： A TAB package for packaging a semiconductor chip includes a flexible base plate having a first surface and a second surface opposite to the first surface, an input and output leads being formed on the second surface of the flexible base plate and capable of being connected to the semiconductor chip, and a plurality of slits being formed on the first surface of the flexible base plate. Accordingly, the TAB package is allowed to be easily bent and kept in the bending state. The slits are formed in a manner to correspond to the intervals between the adjacent input and output leads so that the input and output leads can be reliably supported by the flexible base plate.

公开(公告)号：US4949155A

公开(公告)日：1990-08-14

申请号：US219218

申请日：1988-07-14

申请人： Naoyuki Tajima ,  Takaaki Tsuda ,  Yasunori Chikawa

发明人： Naoyuki Tajima ,  Takaaki Tsuda ,  Yasunori Chikawa

IPC分类号： H01L23/495 ,  H05K1/02

CPC分类号： H01L23/49572 ,  H01L2924/0002 ,  H05K1/0254

摘要： A tape carrier for semiconductor chips including an insulating tape; a plurality of first conductor patterns longitudinally formed on the tape and spaced from each other each of the first conductor patterns having first leads connected with substrate electrodes of a semiconductor chip and second lead connected with the other electrodes of the chip; a second conductor shaped like a stripe and disposed near each of the first conductor patterns on the tape; and a third conductor pattern formed on the tape and having conductors electrically connecting the first leads with the second conductor pattern.

公开(公告)号：US5402255A

公开(公告)日：1995-03-28

申请号：US19907

申请日：1993-02-19

申请人： Hiroyuki Nakanishi ,  Yasunori Chikawa ,  Naoyuki Tajima ,  Hiroshi Nishioka

发明人： Hiroyuki Nakanishi ,  Yasunori Chikawa ,  Naoyuki Tajima ,  Hiroshi Nishioka

IPC分类号： G02F1/13 ,  H01L23/498 ,  H05K1/14 ,  H05K3/36 ,  G02F1/1343

CPC分类号： G02F1/13452 ,  H01L23/4985 ,  H01L2224/49175 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K1/14 ,  H05K3/361

摘要： A liquid crystal panel module includes a liquid crystal panel and a plurality of tape carrier packages arranged along a side of the liquid crystal panel. A semiconductor element is attached to the tape carrier packages for operating the liquid crystal panel. Further, outer leads are disposed in the tape carrier packages on both sides of the semiconductor element and connected to each other between adjacent tape carrier packages. Finally, wires are disposed in the semiconductor element to electrically connect the outer leads, disposed on both sides of the semiconductor element, to each other.

摘要翻译： 液晶面板模块包括液晶面板和沿着液晶面板一侧布置的多个带状载体封装。 将半导体元件附接到用于操作液晶面板的带载体封装。 此外，外部引线设置在半导体元件两侧的带状载体封装中，并在相邻的载带封装之间相互连接。 最后，将导线设置在半导体元件中，将设置在半导体元件两侧的外引线彼此电连接。

公开(公告)号：US06407796B2

公开(公告)日：2002-06-18

申请号：US09873393

申请日：2001-06-05

申请人： Naoyuki Tajima ,  Yasunori Chikawa ,  Shunichi Murahashi ,  Seijirou Gyouten

发明人： Naoyuki Tajima ,  Yasunori Chikawa ,  Shunichi Murahashi ,  Seijirou Gyouten

IPC分类号： G02F11345

CPC分类号： H01L23/5387 ,  H01L2224/73204 ,  H01L2924/09701 ,  H05K1/14 ,  H05K3/361

摘要： A tape carrier package is provided, which includes: a line provided on one surface of a tape substrate; and a semiconductor chip mounted on an other surface of the tape substrate, the semiconductor chip having an electrode which is electrically connected to the line. The line extends from one end to an opposite end of the tape substrate and includes a connection where an intermediate line portion provided in a middle between the ends is electrically connected to the electrode.

摘要翻译： 提供一种胶带载体包装，其包括：设置在带基材的一个表面上的线; 以及安装在所述带基板的另一表面上的半导体芯片，所述半导体芯片具有电连接到所述线的电极。 该线从带基材的一端延伸到另一端，并且包括其中设置在端部之间的中间的中间线部分与电极电连接的连接。

公开(公告)号：US5398128A

公开(公告)日：1995-03-14

申请号：US868561

申请日：1992-04-15

申请人： Naoyuki Tajima ,  Takaaki Tsuda

发明人： Naoyuki Tajima ,  Takaaki Tsuda

IPC分类号： H01L21/60 ,  G02F1/13 ,  H01L23/14 ,  H05K1/00 ,  H05K1/02 ,  H05K3/28 ,  H05K3/36 ,  G02F1/1333 ,  G02F1/1335

CPC分类号： H05K1/028 ,  H01L23/145 ,  H05K1/0278 ,  G02F1/13452 ,  H01L2924/0002 ,  H05K2201/0133 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/10136 ,  H05K2203/063 ,  H05K2203/302 ,  H05K3/28 ,  H05K3/281 ,  H05K3/361

摘要： A board for installation in a liquid crystal panel with at least one slit at a portion thereof to be bent has a resin coating applied to a bridge portion of a conductive pattern formed over the slit. The resin coating resists external load applied during bending of the board. This board may be made by a method having the steps of punching a slit in the board corresponding to a position where the board is to be bent; forming a metal laminate on the board; forming a conductive pattern by etching the metal laminate; applying a resin coating capable of resisting an external load, which is applied during subsequent bending of the board, onto the conductive pattern across the slit; and curing the resin coating. The board is thereafter bent and installed in a liquid crystal panel.

摘要翻译： 用于安装在液晶面板中的用于弯曲部分的至少一个狭缝的板具有施加到形成在狭缝上的导电图案的桥接部分的树脂涂层。 树脂涂层可抵抗板弯曲期间施加的外部载荷。 该板可以通过以下步骤制成：具有对与板要弯曲的位置对应的板中的狭缝进行冲压的步骤; 在板上形成金属层压板; 通过蚀刻金属层压体形成导电图案; 施加能够抵抗在随后的板弯曲期间施加的外部负载的树脂涂层穿过所述狭缝; 并固化树脂涂层。 然后将板弯曲并安装在液晶面板中。

公开(公告)号：US08529759B2

公开(公告)日：2013-09-10

申请号：US11994506

申请日：2005-07-20

申请人： Naoyuki Tajima ,  Koji Yamanaka ,  Hiroshi Inoue ,  Akira Nakamura

发明人： Naoyuki Tajima ,  Koji Yamanaka ,  Hiroshi Inoue ,  Akira Nakamura

IPC分类号： C02F1/469

CPC分类号： B01J20/28042 ,  B01D61/48 ,  B01D61/485 ,  B01J47/018 ,  B01J47/08 ,  C02F1/441 ,  C02F1/4695 ,  C02F5/00 ,  C02F2201/4611 ,  C02F2201/46115 ,  C02F2201/4617

摘要： An electric deionized water production apparatus in which a direct current field is applied to a deionizing chamber packed with an ion-exchange material such that ions to be discharged are allowed to migrate in the direction identical or opposite to the direction of the water flow in the ion-exchange material, whereby ionic impurities adsorbed in the ion-exchange material are discharged from the system, the ion-exchange material being a mixture of a monolith-shaped organic porous ion-exchange material and ion-exchange resin particles. The electric deionized water production apparatus has a simple structure that can reduce material cost, process cost, and assembly cost, capable of accelerating migration of the adsorbed ionic impurities to facilitate discharge of the adsorbed ions and free from a deflected flow due to swelling or shrinkage accompanying an ion-exchanging reaction, and from poor contact with an ion-exchange membrane.

摘要翻译： 一种电去离子水生产装置，其中直流电场施加到装有离子交换材料的去离子室，使得排出的离子允许沿与水流中的水流方向相同或相反的方向迁移 离子交换材料，其中吸附在离子交换材料中的离子杂质从系统中排出，离子交换材料是整料形有机多孔离子交换材料和离子交换树脂颗粒的混合物。 电去离子水生产设备具有简单的结构，其可以降低材料成本，工艺成本和组装成本，能够加速吸附的离子杂质的迁移，以促进吸附的离子的排出并且由于膨胀或收缩而没有偏转的流动 伴随着离子交换反应，并且与离子交换膜接触不良。