发明授权
- 专利标题: Semiconductor apparatus and method of manufacturing the same
- 专利标题(中): 半导体装置及其制造方法
-
申请号: US235371申请日: 1994-04-29
-
公开(公告)号: US5506813A公开(公告)日: 1996-04-09
- 发明人: Yoshio Mochizuki , Hideo Kato , Nobutake Sugiura
- 申请人: Yoshio Mochizuki , Hideo Kato , Nobutake Sugiura
- 申请人地址: JPX Kawasaki
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JPX Kawasaki
- 优先权: JPX5-128183 19930501
- 主分类号: G11C16/04
- IPC分类号: G11C16/04 ; G11C11/56 ; G11C17/12 ; H01L21/822 ; H01L21/8246 ; H01L27/04 ; H01L27/112 ; G11C7/00 ; H01L27/10
摘要:
In a semiconductor memory apparatus having a cell array structure wherein occurrence of leak current is reduced and a margin at the time of sensing is increased, a plurality of memory transistors arranged in a matrix and having any one of four thresholds constitute banks in a column direction. The banks constitute memory cell arrays. A main bit line of Al is connected to three sub-bit lines via first selection transistors. A main ground line of Al is connected to two sub-ground lines via second selection transistors. Bank selection lines and word lines are formed to cross the main bit line and main ground line. Gates of the selection transistors are connected to the selection lines, and one selection line is connected to one selection transistor. Each of the sub-bit lines and sub-ground lines has a column of memory transistors which constitute a bank. A separation region (not shown) of a silicon oxide film, etc. is formed between the memory cell arrays to prevent leak current. Thereby, an information amount per one element can be made equal to a plural-bit information amount, and the bit data capacity can be increased.
公开/授权文献
- US4878016A Soldering iron testing method and apparatus 公开/授权日:1989-10-31
信息查询