发明授权
- 专利标题： Solvent-less vapor deposition apparatus and process for application of soldering fluxes
- 专利标题（中）： 无溶剂气相沉积设备及其助焊剂的应用方法
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申请号： US343072申请日： 1994-11-21
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公开(公告)号： US5514414A公开(公告)日： 1996-05-07
- 发明人: Guilian Gao , Peter J. Sinkunas , Brenda J. Nation , Myron Lemecha , Lawrence Kneisel
- 申请人： Guilian Gao , Peter J. Sinkunas , Brenda J. Nation , Myron Lemecha , Lawrence Kneisel
- 申请人地址： MI Dearborn
- 专利权人： Ford Motor Company
- 当前专利权人： Ford Motor Company
- 当前专利权人地址： MI Dearborn
- 主分类号： B23K1/015
- IPC分类号： B23K1/015 ; B23K35/36 ; B23K35/38 ; H05K3/34 ; C23C14/00
摘要：
Apparatus and method for condensing a solderless flux vapor onto a work surface to be soldered, such as an electronic circuit board. The flux vapor is created by heating flux in a liquid state to a temperature greater than the temperature of the work surface. Flux is applied to the work surface without the use of any volatile organic chemicals.
公开/授权文献
- US4953467A Track surfacing machine with track stabilization 公开/授权日：1990-09-04
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