发明授权
- 专利标题: Resin forming compositions
- 专利标题(中): 树脂成型组合物
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申请号: US547517申请日: 1995-10-24
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公开(公告)号: US5525704A公开(公告)日: 1996-06-11
- 发明人: Shoji Tamai , Norimasa Yamaya , Masahiro Ohta , Akihiro Yamaguchi
- 申请人: Shoji Tamai , Norimasa Yamaya , Masahiro Ohta , Akihiro Yamaguchi
- 申请人地址: JPX Tokyo
- 专利权人: Mitsui Toatsu Chemicals, Inc.
- 当前专利权人: Mitsui Toatsu Chemicals, Inc.
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX1-275050 19891024; JPX2-052779 19900306; JPX2-119679 19900511; JPX2-132711 19900524; JPX2-177517 19900706; JPX2-177518 19900706; JPX2-210246 19900810
- 主分类号: C07C201/12
- IPC分类号: C07C201/12 ; C07C205/38 ; C07C213/02 ; C07C217/90 ; C07D207/44 ; C07D207/452 ; C08G73/12 ; C08G73/10
摘要:
Disclosed is an aromatic diamine compound represented by the formula (I) ##STR1## wherein R is H or CH.sub.3. Also disclosed is a bismaleimide compound represented by the formula (IV) ##STR2## wherein R is H or CH.sub.3, A resin forming composition comprising these compounds is also disclosed. The compounds are useful as raw materials for resins, and the resin forming composition and the resin can provide excellent heat resistance and impact resistance and low hygroscopicity.
公开/授权文献
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