公开(公告)号：US5364967A

公开(公告)日：1994-11-15

申请号：US5276

申请日：1993-01-19

申请人： Keizaburo Yamaguchi ,  Tatsuhiro Urakami ,  Yoshimitsu Tanabe ,  Midori Yamazaki ,  Shoji Tamai ,  Norimasa Yamaya ,  Masahiro Ohta ,  Akihiro Yamaguchi

发明人： Keizaburo Yamaguchi ,  Tatsuhiro Urakami ,  Yoshimitsu Tanabe ,  Midori Yamazaki ,  Shoji Tamai ,  Norimasa Yamaya ,  Masahiro Ohta ,  Akihiro Yamaguchi

IPC分类号： C07C201/12 ,  C07C205/38 ,  C07C213/02 ,  C07C217/90 ,  C07D207/44 ,  C07D207/452 ,  C08G73/12 ,  C07C211/50

CPC分类号： C07D207/452 ,  C07C205/38 ,  C07C217/90 ,  C08G73/124

摘要： Disclosed is an aromatic diamine compound represented by the formula (I) ##STR1## wherein R is H or CH.sub.3. Also disclosed is a bismaleimide compound represented by the formula (IV) ##STR2## wherein R is H or CH.sub.3, A resin forming composition comprising these compounds is also disclosed. The compounds are useful as raw materials for resins, and the resin forming composition and the resin can provide excellent heat resistance and impact resistance and low hygroscopicity.

摘要翻译： 公开了由式（I）表示的芳族二胺化合物，其中R是H或CH 3。 还公开了由式（IV）表示的双马来酰亚胺化合物其中R是H或CH 3，其中R是H或CH 3，还公开了包含这些化合物的形成树脂的组合物。 这些化合物可用作树脂的原料，树脂形成组合物和树脂可以提供优异的耐热性和耐冲击性和低吸湿性。

公开(公告)号：US5525704A

公开(公告)日：1996-06-11

申请号：US547517

申请日：1995-10-24

申请人： Shoji Tamai ,  Norimasa Yamaya ,  Masahiro Ohta ,  Akihiro Yamaguchi

发明人： Shoji Tamai ,  Norimasa Yamaya ,  Masahiro Ohta ,  Akihiro Yamaguchi

IPC分类号： C07C201/12 ,  C07C205/38 ,  C07C213/02 ,  C07C217/90 ,  C07D207/44 ,  C07D207/452 ,  C08G73/12 ,  C08G73/10

CPC分类号： C07D207/452 ,  C07C205/38 ,  C07C217/90 ,  C08G73/124

摘要： Disclosed is an aromatic diamine compound represented by the formula (I) ##STR1## wherein R is H or CH.sub.3. Also disclosed is a bismaleimide compound represented by the formula (IV) ##STR2## wherein R is H or CH.sub.3, A resin forming composition comprising these compounds is also disclosed. The compounds are useful as raw materials for resins, and the resin forming composition and the resin can provide excellent heat resistance and impact resistance and low hygroscopicity.

摘要翻译： 公开了由式（I）表示的芳族二胺化合物，其中R是H或CH 3。 还公开了由式（IV）表示的双马来酰亚胺化合物。其中R是H或CH 3，包含这些化合物的树脂形成组合物也被公开。 这些化合物可用作树脂的原料，树脂形成组合物和树脂可以提供优异的耐热性和耐冲击性和低吸湿性。

公开(公告)号：US5484948A

公开(公告)日：1996-01-16

申请号：US284103

申请日：1994-08-02

申请人： Keizaburo Yamaguchi ,  Tatsuhiro Urakami ,  Yoshimitsu Tanabe ,  Midori Yamazaki ,  Shoji Tamai ,  Norimasa Yamaya ,  Masahiro Ohta ,  Akihiro Yamaguchi

发明人： Keizaburo Yamaguchi ,  Tatsuhiro Urakami ,  Yoshimitsu Tanabe ,  Midori Yamazaki ,  Shoji Tamai ,  Norimasa Yamaya ,  Masahiro Ohta ,  Akihiro Yamaguchi

IPC分类号： C07C201/12 ,  C07C205/38 ,  C07C213/02 ,  C07C217/90 ,  C07D207/44 ,  C07D207/452 ,  C08G73/12 ,  C07D207/444

CPC分类号： C07D207/452 ,  C07C205/38 ,  C07C217/90 ,  C08G73/124

摘要： Disclosed is an aromatic diamine compound represented by the formula (I) ##STR1## wherein R is H or CH.sub.3. Also disclosed is a bismaleimide compound represented by the formula (IV) ##STR2## wherein R is H or CH.sub.3, A resin forming composition comprising these compounds is also disclosed. The compounds are useful as raw materials for resins, and the resin forming composition and the resin can provide excellent heat resistance and impact resistance and low hygroscopicity.

摘要翻译： 公开了由式（I）表示的芳族二胺化合物，其中R是H或CH 3。 还公开了由式（IV）表示的双马来酰亚胺化合物。其中R是H或CH 3，包含这些化合物的树脂形成组合物也被公开。 这些化合物可用作树脂的原料，树脂形成组合物和树脂可以提供优异的耐热性和耐冲击性和低吸湿性。

公开(公告)号：US5206438A

公开(公告)日：1993-04-27

申请号：US601424

申请日：1990-10-23

申请人： Keizaburo Yamaguchi ,  Tatsuhiro Urakami ,  Yoshimitsu Tanabe ,  Midori Yamazaki ,  Shoji Tamai ,  Norimasa Yamaya ,  Masahiro Ohta ,  Akihiro Yamaguchi

发明人： Keizaburo Yamaguchi ,  Tatsuhiro Urakami ,  Yoshimitsu Tanabe ,  Midori Yamazaki ,  Shoji Tamai ,  Norimasa Yamaya ,  Masahiro Ohta ,  Akihiro Yamaguchi

IPC分类号： C07C201/12 ,  C07C205/38 ,  C07C213/02 ,  C07C217/90 ,  C07D207/44 ,  C07D207/452 ,  C08G73/12

CPC分类号： C07D207/452 ,  C07C205/38 ,  C07C217/90 ,  C08G73/124

摘要： Disclosed is an aromatic diamine compound represented by the formula (I) ##STR1## wherein R is H or CH.sub.3. Also disclosed is a bismaleimide compound represented by the formula (IV) ##STR2## wherein R is H or CH.sub.3, A resin forming composition comprising these compounds is also disclosed. The compounds are useful as raw materials for resins, and the resin forming composition and the resin can provide excellent heat resistance and impact resistance and low hygroscopicity.

公开(公告)号：US5106937A

公开(公告)日：1992-04-21

申请号：US601358

申请日：1990-10-23

申请人： Norimasa Yamaya ,  Shoji Tamai ,  Masahiro Ohta ,  Akihiro Yamaguchi

发明人： Norimasa Yamaya ,  Shoji Tamai ,  Masahiro Ohta ,  Akihiro Yamaguchi

IPC分类号： C08G73/12

CPC分类号： C08G73/124

摘要： Disclosed is a composition for forming a thermosetting resin having excellent impact resistance and toughness. The composition comprises a bismaleimide compound represented by formula (I): ##STR1## wherein R is a hydrogen atom or methyl, and an amine compound represented by formula (II): ##STR2## wherein X is a radical selected from the group of divalent hydrocarbons having from 1 to 10 carbon atoms, hexafluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl, oxo, ##STR3## or by formula (III)): ##STR4## where in n is an integer of 0 to 50. Also disclosed is a process for preparing the composition.

公开(公告)号：US5049606A

公开(公告)日：1991-09-17

申请号：US488443

申请日：1990-02-27

申请人： Norimasa Yamaya ,  Masahiro Ohta ,  Akihiro Yamaguchi

发明人： Norimasa Yamaya ,  Masahiro Ohta ,  Akihiro Yamaguchi

IPC分类号： C08G73/10 ,  C08J5/16 ,  C08K3/04 ,  C08K3/30 ,  C08K3/38 ,  F16C33/20 ,  F16J9/28

CPC分类号： F16J9/28 ,  C08G73/1046 ,  C08G73/1057 ,  C08G73/1071 ,  C08K3/04 ,  C08K3/30 ,  C08K3/38 ,  F16C33/201

摘要： A thermosetting resin composition formed of a polyaminobismaleimide resin, which is composed of a bismaleimide compound and a diamine compound, and a solid lubricant. The composition has low coefficient of friction and excellent wear resistance, and can be utilized for self-lubricating parts.

公开(公告)号：US5051494A

公开(公告)日：1991-09-24

申请号：US511235

申请日：1990-04-19

申请人： Keizaburo Yamaguchi ,  Yoshimitsu Tanabe ,  Tatshuiro Urakami ,  Akihiro Yamaguchi ,  Norimasa Yamaya ,  Masahiro Ohta

发明人： Keizaburo Yamaguchi ,  Yoshimitsu Tanabe ,  Tatshuiro Urakami ,  Akihiro Yamaguchi ,  Norimasa Yamaya ,  Masahiro Ohta

IPC分类号： C07C211/50 ,  C08G73/12

CPC分类号： C08G73/121 ,  C07C211/50

摘要： The invention relates to an aromatic amine resin comprising a mixture of aromatic amine compounds represented by the following general formula (a): ##STR1## wherein A represents a phenylene, alkyl-substituted phenylene, diphenylene, diphenyl ether or naphthylenyl group, R.sup.1 represents a halogen atom or a hydroxyl C.sub.1-4 alkoxy or C.sub.1-5 alkyl group, l is 1 or 2, m is 0, 1, 2 or 3, n is an integer from 0 to 300 and when m is 2 or 3, the R.sup.1 group may be the same or different and may join to form a 5- or 6-membered alicyclic moiety which may optionally contain one or more side chains, and also relates to processes for producing the same and a thermosetting composition containing the same.

公开(公告)号：US4987207A

公开(公告)日：1991-01-22

申请号：US351470

申请日：1989-05-15

申请人： Norimasa Yamaya ,  Masahiro Ohta ,  Akihiro Yamaguchi

发明人： Norimasa Yamaya ,  Masahiro Ohta ,  Akihiro Yamaguchi

IPC分类号： C08K5/3415 ,  C08K5/375 ,  C08K5/41

CPC分类号： C08K5/375 ,  C08K5/3415 ,  C08K5/41

摘要： The present invention relates to a thermosetting resin composition comprising about 100 parts by weight of a polyimide and from 5 to about 100 parts by weight of a bismaleimide having a similar structure and processes for preparing the same.

公开(公告)号：US4937318A

公开(公告)日：1990-06-26

申请号：US254701

申请日：1988-10-07

申请人： Keizaburo Yamaguchi ,  Yoshimitsu Tanabe ,  Tatsuhiro Urakami ,  Akihiro Yamaguchi ,  Norimasa Yamaya ,  Masahiro Ohta

发明人： Keizaburo Yamaguchi ,  Yoshimitsu Tanabe ,  Tatsuhiro Urakami ,  Akihiro Yamaguchi ,  Norimasa Yamaya ,  Masahiro Ohta

IPC分类号： C07C211/50 ,  C08G73/12

CPC分类号： C08G73/121 ,  C07C211/50

摘要： The invention relates to an aromatic amine resin comprising a mixture of aromatic amine compounds represented by the following general formula (a): ##STR1## wherein A represents a phenylene, alkyl-substituted phenylene, diphenylene, diphenyl ether or napthylenyl group, R.sup.1 represents a halogen atom or a hydroxyl C.sub.1-4 alkoxy or C.sub.1 -5 alkyl group, l is 1 or 2, m is 0, 1, 2 or 3, n is an integer from 0 to 300 and when m is 2 or 3, the R.sup.1 group may be same or different and may join to form a 5- to 6-membered alicyclic moiety which may optionally contain one or more side chains, and also relates to processes for producing the same and a thermosetting composition containing the same.

公开(公告)号：US5106953A

公开(公告)日：1992-04-21

申请号：US511093

申请日：1990-04-19

申请人： Keizaburo Yamaguchi ,  Yoshimitsu Tanabe ,  Tatsuhiro Urakami ,  Akihiro Yamaguchi ,  Norimasa Yamaya ,  Masahiro Ohta

发明人： Keizaburo Yamaguchi ,  Yoshimitsu Tanabe ,  Tatsuhiro Urakami ,  Akihiro Yamaguchi ,  Norimasa Yamaya ,  Masahiro Ohta

IPC分类号： C07C211/50 ,  C08G73/12

CPC分类号： C08G73/121 ,  C07C211/50

摘要： The invention relates to an aromatic amine resin comprising a mixture of aromatic amine compounds represented by the following general formula (a): ##STR1## wherein A represents a phenylene, alkyl-substituted phenylene, diphenylene, diphenyl ether or naphthylenyl group, R.sup.1 represents a halogen atom or a hydroxyl C.sub.1-4 alkoxy or C.sub.1-5 alkyl group, l is 1 or 2, m is 0, 1, 2 or 3, n is an integer from 0 to 300 and when m is 2 or 3, the R.sup.1 group may be same or different and may join to form a 5- or 6-membered alicyclic moiety which may optionally contain one or more side chains, and also relates to processes for producing the same and a thermosetting composition containing the same.